Plasma resistance of quartz with a glass coating layer by aerosol deposition

Abstract

To improve the plasma resistance behaviour, glass frits of SiO 2 -Al 2 O 3 -Y 2 O 3 with various powder sizes were coated onto quartz substrates by the aerosol deposition (AD) method. The thickness and microstructure of the coating layers were observed using a surface profiler and scanning electron microscopy. Plasma resistance was measured via the quartz substrate, after exposure to an inductively coupled plasma etcher. The coating layers were densely formed on the quartz substrates without additional heat treatment, and the layer thickness changed for the glass frit size distribution and AD process conditions. The SiO 2 -Al 2 O 3 -Y 2 O 3 glass coating layer showed a higher plasma resistance than quartz. Furthermore, the AD coating layer was evenly etched after plasma exposure. This study improves the lifetime of plasma chamber components in the semiconductor industry.

Deposition behavior of glass thick film formation on substrates with different hardness by aerosol deposition

“…Glass coating layers are used widely across many fields, such as the semiconductor and display industries, using high-density plasma and biomaterials for dental implants and bones. The thickness of the coating layer ranges from 2 μm to 250 μm depending on the application [1][2][3][4][5][6]. On the other hand, the coating process has been limited to certain substrates due to mismatch of the thermal expansion coefficients between the substrates and materials.…”

“…Aerosol deposition (AD), which enables the manufacture of thick ceramic films at room temperature, is a technique that sprays an aerosol formed from a raw material powder onto a substrate through a nozzle to obtain a dense, thick film [7,8]. This method can theoretically form thick films of various materials on any substrate at room temperature without additional heat treatments [2,4,5,9,10]. AD film formation is less affected by the difference in the coefficient of thermal expansion between the film and the substrate because of room temperature processing.…”

“…Therefore, the initial coating layer state is affected by the hardness of the substrate. Once this initial layer is formed, the coating layer was thickened further via the impact of subsequent particles [5,12]. From the second layer, coating layer conditions, such as the microstructure and thickness, are affected by the coating process [7,9].…”