Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

Yanaka, Yuichi; Kariya, Yoshiharu; Watanabe, Hirohiko; Hokazono, Hiroaki

doi:10.2320/matertrans.md201503

Cited by 17 publications

(6 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, our results show that pure Bi is significantly softer than the Sn-solid solution phase, in terms of both stiffness and hardness. Yanaka et al 19 studied the tensile stress-strain behavior of Bi single crystals and hypothesized that plastic deformation in 1 3 these materials occurs by twinning initially, followed by secondary slip. Thus, embrittlement due to Bi addition in solder needs to be investigated focusing on the cooperative deformation behavior between Bi and Sn phases.…”

Section: Resultsmentioning

confidence: 99%

Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging

Wang

Luktuke

Chawla

2021

J. Electron. Mater.

View full text Add to dashboard Cite

With miniaturization and heterogeneous integration in packaging, there has been a drive toward developing lower temperature solders. Sn-58Bi eutectic solder provides an attractive alternative with its meting point at 138°C. Due to the lower melting temperature of Sn-Bi solder, Bi coarsening may occur even at room temperature. In this paper, the microstructural evolution in Sn-58Bi joints was observed during room temperature storage. Room temperature aging induced the dissolution and coarsening of Bi phases in the solder matrix, especially in the primary Sn phases and Sn-Bi dendrites. The mechanical properties of individual Sn-rich and Bi-rich phases were measured by nanoindentation. The results showed that the Sn-rich phases had higher Young's modulus and hardness than Bi-rich phases in aged solder joints due to solution strengthening. Bi phases were more compliant and had lower hardness than Sn.

show abstract

Section: Resultsmentioning

confidence: 99%

Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging

Wang

Luktuke

Chawla

2021

J. Electron. Mater.

View full text Add to dashboard Cite

show abstract

“…As shown above in Figure 8a, at bending force directed along the binary axis OZ (Fb || <101 ̅ >), the stress-strain curves of single crystals show sharp drops and rises after the yielding point at 22.7 MPa. The occurrence of sharp sawtooth stress drops or serrations during compression and tension deformations of bismuth and antimony single crystals due to twinning was indicated earlier [25][26][27][28]. Klassen-Neklyudova [25] summarized that elastic and residual twinning is formed under loading of bismuth and antimony crystals.…”

Section: Discussionmentioning

confidence: 99%

“…Deformation modes observed after compression tests at the strain rate of 1.7 × 10 −4 on bismuth crystals of various orientations, mainly at the temperature −80 • C (193 K) and more, are slip on (111) plane and twinning along the (011), (101), and (110) planes [27]. In the tensile test, twinning easily occurs at a strain rate of 1 × 10 −3 s −1 [28] and is suppressed at a strain rate of 1 × 10 −4 s −1 or lower [29,30].…”

Section: Discussionmentioning

confidence: 99%

A Novel Method to Significantly Improve the Mechanical Properties of n-Type Bi(1−x)Sbx Thermoelectrics Due to Plastic Deformation

Sidorenko¹,

Unigovski

Dashevsky

et al. 2021

Electronic Materials

View full text Add to dashboard Cite

A unique method was developed to significantly improve the strength of Bi(1−x)Sbx single crystals, the most effective thermoelectric (TE) materials in the temperature range from 100 to 200 K due to their plastic deformation by extrusion. After plastic deformation at room temperature under all-round hydrostatic compression in a liquid medium, n-type Bi–Sb polycrystalline solid solutions show a significant increase in mechanical strength compared to Bi–Sb single crystals in the temperature range from 300 to 80 K. The significantly higher strength of extruded alloys in comparison with Bi–Sb single crystals is associated with the development of numerous grains with a high boundary surface as well as structural defects, such as dislocations, that accumulate at grain boundaries. Significant stability of the structure of extruded samples is achieved due to the uniformity of crystal plastic deformation under all-round hydrostatic compression and the formation of the polycrystalline structure consisting of grains with the orientation of the main crystallographic directions close to the original single crystal. The strengthening of Bi–Sb single crystals after plastic deformation allows for the first time to create workable TE devices that cannot be created on the basis of single crystals that have excellent TE properties, but low strength.

show abstract

“…The strain rate was set to be approximately 1 × 10 −5 s −1 to avoid twin formation. Twinning deformation easily occurs at a strain rate of 1 × 10 −3 s −1 [16,17] and is suppressed at a strain rate of 1 × 10 −4 s −1 or lower [15,18]. The rectangular samples were deformed by compression at room temperature up to 10%.…”

Section: Methodsmentioning

confidence: 99%

High-Density Well-Aligned Dislocations Introduced by Plastic Deformation in Bi1−xSbx Topological Insulator Single Crystals

2019

View full text Add to dashboard Cite

Topological insulators (TIs) have a bulk bandgap and gapless edge or surface states that host helically spin-polarized Dirac fermions. Theoretically, it has been predicted that gapless states could also be formed along dislocations in TIs. Recently, conductivity measurements on plastically deformed bismuth antimony (Bi1−xSbx) TIs have revealed excess conductivity owing to dislocation conduction. For further application of them, fundamental study on dislocations in TIs is indispensable. Dislocations controlled based on fundamental studies could potentially be useful not only for experimental investigations of the dislocation properties but also for diverse device applications. In the present study, Bi1−xSbx TI single crystals were fabricated by a zone-melting method. The crystals were plastically deformed at room temperature. The resultant dislocations were observed by transmission electron microscopy (TEM). It was found that high-density dislocations with the Burgers vector satisfying the condition for the formation of gapless states were successfully introduced. The dislocations were mostly of edge type with lengths on the order of more than a few micrometers.

show abstract

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

Cited by 17 publications

References 20 publications

Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging

Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging

A Novel Method to Significantly Improve the Mechanical Properties of n-Type Bi(1−x)Sbx Thermoelectrics Due to Plastic Deformation

High-Density Well-Aligned Dislocations Introduced by Plastic Deformation in Bi1−xSbx Topological Insulator Single Crystals

Contact Info

Product

Resources

About