Plastic packages survive where hermetic packages fail

Sinnadurai, Nihal

doi:10.1016/0026-2714(96)00065-0

Cited by 6 publications

(4 citation statements)

References 14 publications

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“…Because of this limitation, a package regarded as non-leaky could indeed become saturated with water vapour (Vanhoestenberghe and Donaldson 2011). The importance of this limitation cannot be understated, as it may lead to incorrect interpretation of the leak test results and acceptance of actually unsuitable packages (Sinnadurai 1996). This is critical as the lifetime prediction gives confidence in the hermetic protection method, and seems to have been instrumental in its commercial adoption (Bowman and Meindl 1986).…”

Section: Lifetime Estimationsmentioning

confidence: 99%

Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices

2013

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Corrosion is a prime concern for active implantable devices. In this paper we review the principles underlying the concepts of hermetic packages and encapsulation, used to protect implanted electronics, some of which remain widely overlooked. We discuss how technological advances have created a need to update the way we evaluate the suitability of both protection methods. We demonstrate how lifetime predictability is lost for very small hermetic packages and introduce a single parameter to compare different packages, with an equation to calculate the minimum sensitivity required from a test method to guarantee a given lifetime. In the second part of this paper, we review the literature on the corrosion of encapsulated integrated circuits (ICs) and, following a new analysis of published data, we propose an equation for the pre-corrosion lifetime of implanted ICs, and discuss the influence of the temperature, relative humidity, encapsulation and field-strength. As any new protection will be tested under accelerated conditions, we demonstrate the sensitivity of acceleration factors to some inaccurately known parameters. These results are relevant for any application of electronics working in a moist environment. Our comparison of encapsulation and hermetic packages suggests that both concepts may be suitable for future implants.

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Section: Lifetime Estimationsmentioning

confidence: 99%

Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices

2013

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“…"The encapsulant is not intended to be a barrier to moisture but, by adhering to the device surfaces and filling the spaces between conductors, it prevents water from condensing, which would permit ionic conduction and thus, perhaps after some time, failure (by leakage currents, gas evolution, corrosion, etc)." Encapsulation in waxes, epoxy resins or silicone rubbers can provide protection lasting more than ten years (Donaldson & Sayer 1981a;Donaldson 1988;Sinnadurai 1996). However, any failure of adhesion between the encapsulant and the components can create a void where water vapour can condense, with the consequences mentioned in the quoted paragraph above (Donaldson & Sayer 1981a).…”

Section: Encapsulationmentioning

confidence: 99%

“…Rules are given in order to avoid such failure by optimizing component shape as well as the choice of encapsulant, insulator, and conductor (Donaldson & Sayer 1981a;Donaldson & Sayer 1981b). Plastic encapsulation using junction coatings can also provide very high protection of semi conductor devices (Sinnadurai 1996).…”

Section: Encapsulationmentioning

confidence: 99%

The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant

Dahan¹,

Donaldson²,

Taylor³

et al. 2013

Journal of Microelectronics and Electronic Packaging

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PEEK is a polymer that is used in many orthopaedic implants because of its favourable mechanical properties and its biocompatibility. High-reliability electronic implants such as pacemakers have 'hermetic' enclosures with the electronic components in dry gas. This type of package, generally made of metal or ceramic, guarantees a very long lifetime, but is also expensive. PEEK can be easily machined or injection-moulded, it is an attractive material for implant manufacturers and it may be that by novel design based on established material properties, PEEK may be used in some applications. This thesis examines the case of PEEK as a packaging material for applications which only require a more limited lifetime (less than three years). The process of moisture ingress through polymers is analysed, and a novel calculation method to quantify it is developed, based on an electrical analogy and Tencer's approximation of the full solution to Fick's laws of diffusion. A telemetry system is designed, which allows measuring the relative humidity inside a PEEK capsule. Diagrams, PCB layouts, microcontroller program and component lists are provided, making this design easily reproducible. Contents

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“…B. Temperatursensoren, Str6mungssensoren, Gassensoren, Feuchtesensoren usw.) werden in vielen Anwendungsfallen nur durch ihre AnschluBdr~ihte gehalten [2]. Diese einfache und kostengª Verbindungstechnik erfordert wegen der notwendigen mechanischen Stabilit~it relativ dicke Dr~hte.…”

Section: Introductionunclassified

Das Laserlöten als Kontaktierungsverfahren für Mikrosensoren

Nicolics

Musiejovsky

Chabicovsky

1998

Elektrotech. Inftech.

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Miniaturisierte Sensorelemente (z. B. Temperatursensoren, Str6mungssensoren, Gassensoren, Feuchtesensoren usw.) werden h~iufig nur durch ihre Anschlul~dr~ihte gehalten. Das Laserl6ten erm6glicht die Verbindung von relativ dicken Drahten mit sehr dª Metallisierungen auf dem Sensorchip. In diesem Beitrag werden zun~ichst theoretische Aspekte des dynamischen Benetzungsvorgangs und des Ablegierens diskutiert. AnschlieBend wird der EinfluB des Substratmaterials auf die L6t-parameter (Laserleistung, Strahleinwirkdauer) behandelt und der L6tvorgang durch Temperaturmessungen mit Dª die in die L6tstelle integriert sind, analysiert. Schlª Laserl6ten; dynamischer Benetzungsvorgang; Ablegierrate; Mikrosensoren; Dª L6tstellenqualit~itLaser soldering asa bonding technique for microsensors. Miniaturized sensor elements (e.g. temperature sensors, flow sensors, gas sensors, humidity sensors, etc.) are frequently carried only by their lead-in wires. Laser soldering provides a possibility to attach relatively thick wires to thin film metallizations on a sensor chip. This paper first discusses theoretical aspects of the dynamic wetting process and the leaching phenomenon. Subsequently, it describes the influence of the substrate material on the soldering parameters (laser power and pulse duration) and analyzes the soldering process by temperature.measurements using thin film thermocouples integrated in the soldering pad.

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Plastic packages survive where hermetic packages fail

Cited by 6 publications

References 14 publications

Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices

Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices

The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant

Das Laserlöten als Kontaktierungsverfahren für Mikrosensoren

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