Plated Ni/Cu/Ag for TOPCon Solar Cell Metallization

Glatthaar, Markus; Landgraf, Dirk; Kluge, T.; Kluska, Sven; Steinhauser, Bernd; Feldmann, Frank; Fellmeth, Tobias; Arya, Varun; Cimiotti, G.; Grübel, Benjamin

doi:10.4229/eupvsec20192019-2bo.2.3

Cited by 4 publications

(1 citation statement)

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“…Hallam et al showed that this limitation can't be overcome with the current perspective of technological improvements of silver screen printing estimated by the ITRV roadmap [6]. Recent publications showed that the combination of laser structuring the electrically insulating anti reflective coating (ARC) and plating of nickel, copper and silver can be successfully implemented in the fabrication sequence of bifacial TOPCon solar cells [7,8].…”

Section: Introductionmentioning

confidence: 99%

Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection

et al. 2021

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This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 μm height), highly conductive copper finger (3–10 μm height) and an ultra-thin surface finish by tin (1–3 μm height) or silver (<0.5 μm height). In this study it will be shown that conventional soldering technology can be used to interconnect plated TOPCon solar cells. We manufactured a 60-cell module using industrial processes. The right choice of plating electrolyte allows low stress and ductile metal finger leading to similar reliability in cell breakage experiments compared to state-of-the-art screen-printing metallization.

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Section: Introductionmentioning

confidence: 99%