Polishing properties of porous silica abrasive on hard disk substrate CMP

Liu, Ping; Lei, Hong; Chen, RuLing

doi:10.1504/ijat.2010.034053

Cited by 8 publications

(4 citation statements)

References 20 publications

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“…As shown in Fig. 4, the MRR of hard disk substrate increases with the increasing of rotating speed, which is attributed to the increasing chance of friction between hard disk substrate, polishing pad and abrasives (Liu et al, 2010). Moreover, the Ra value decreases with the increase of the rotating speed which is attributed to the high material removal amount at the high rotating speed.…”

Section: Characterization Of Spherical Porous Sba-15mentioning

confidence: 82%

“…Based on the method of preparing wheat-head porous silica (Liu et al, 2010) we got spherical porous silica by adding Hexadecyl Trimethyl Ammonium Bromide (CTAB). The experiment process of preparation of spherical porous silica abrasive and Slurry is shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

“…The result showed the wheat-head porous abrasive may have good application prospects in CMP (Liu et al, 2010). Compared with compact solid particle abrasive, the hardness of porous particle abrasive is reduced due to the porous structure inside.…”

Section: Introductionmentioning

confidence: 97%

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Preparation and Polishing Properties of Spherical Porous Silica Abrasive

Lei¹

2010

American Journal of Nanotechnology

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Problem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in polished surface quality. The aim of this research paper is to find the differences of CMP performances on hard disk between solid silica abrasives and porous silica abrasives. Approach: A kind of spherical porous silica abrasive was prepared and its CMP performances on hard disk had been investigated. The influences of polishing parameters including polishing time, down force and rotation speed on Material Removal Rate (MRR) and average roughness (Ra) were studied in hard disk substrate CMP with these prepared spherical porous SBA-15 abrasives and solid silica abrasives. Results: After polished in slurry containing solid SiO 2 , the surface became smooth and Ra decreased from 8.234-1.159 nm. However some small scratches still existed there. When polished with slurry containing spherical porous SBA-15 under the same polishing conditions, the surface became smoother, the scratches could hardly be observed and Ra decreased from 8.409-0.539 nm. Conclusion: Compared with solid silica abrasive, the prepared spherical porous silica abrasive has better hard disk substrates CMP performance under the same polishing conditions.

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Section: Characterization Of Spherical Porous Sba-15mentioning

confidence: 82%

Section: Methodsmentioning

confidence: 99%

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Preparation and Polishing Properties of Spherical Porous Silica Abrasive

Lei¹

2010

American Journal of Nanotechnology

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“…12,13 Furthermore, ceriumincorporated porous silica composite abrasives with larger pores 14 showed a better CMP performance than porous silica. Their special pore channel structure could reduce the hardness of the abrasives in that, after polishing by a slurry containing porous silica abrasive, a smoother surface with less scratching was obtained than with compact solid particles.…”

Section: Introductionmentioning

confidence: 95%

Preparation of porous alumina/ceria composite abrasive and its chemical mechanical polishing behavior

Chen

Lei

Chen

2013

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Effects of manganese oxide-mixed abrasive slurry on the tetraethyl orthosilicate oxide chemical mechanical polishing for planarization of interlayer dielectric film in the multilevel interconnection A porous alumina/ceria composite abrasive is synthesized by the hydrothermal synthesis method with transmission electron microscope images showing that it has wormhole-like pores. The chemical mechanical polishing performance of the synthesized abrasive on hard disk substrates was then investigated and the results showed that, compared with pure porous alumina and solid alumina, the porous alumina/ceria composite abrasive has a higher material removal rate because of the presence of the active polishing element cerium. Also, the surfaces polished by the porous alumina abrasives had much fewer topographical variations and a lower surface roughness than those polished by solid alumina abrasive.

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