Polycarbonate bonding assisted by surface chemical modification without plasma treatment and its application for the construction of plastic-based cell arrays

One-step glass-like coating of polycarbonate for seamless DNA purification and amplification on an integrated monolithic microdevice

“…The shear strength was measured to be approximately 950 kPa, which was comparable to results of previous studies [43], but the PC substrates in this study had a much simpler surface coating obtained with milder bonding conditions. When 5% APTES was used instead of 5% ABPTMS for bonding two PC substrates under the same bonding condition (128 • C, 0.1 MPa, 30 min), the average bond strength was approximately 660 kPa, which also corresponded with our previous study [24]. The reliability of the bonding was further examined by performing a high-throughput leak test inside a hexagonal microchannel with a total internal volume of approximately 48 L. The flow rates of ink injection were set at 0.48, 4.8, 48, or 96 mL min −1 , with per-minute injection volumes corresponding to 10, 100, 1000, and 2000 times the total internal volume of the microchannel used.…”

“…Recently, the formation of urethane bonds, which involve the donation of a lone pair of electrons in an amine functional group to a carbonate group, has been widely adopted for facile, room temperature surface modification of plastics, particularly with PC [2,[24][25][26][27][28][29]. 3-(Aminopropyl)triethoxysilane (APTES) is commonly used to enable the formation of urethane bonds with PC.…”

Instantaneous room temperature bonding of a wide range of non-silicon substrates with poly(dimethylsiloxane) (PDMS) elastomer mediated by a mercaptosilane

“…8 Considering that hybrid microstructures constructed with PDMS and non-silicon-based materials have potential benefits when fabricating microvalves [9][10][11] and when assembling heterogeneous substrates in microelectronics and packaging areas, researchers began to show great interest concerning the bonding of silicon-based PDMS with nonsilicon-based substrates. [12][13][14][15][16][17][18][19][20][21][22][23][24] Im et al 12 grafted an epoxy-containing polymer, poly(glycidyl methacrylate) (PGMA), via an initiated chemical deposition (iCVD) method and reacted it with a partner substrate activated with plasma polymerized polyallylamine (PAAm) to realize bonding at 70 °C. Xu and Gleason 13 deposited glycidyl methacrylate and 4-aminostyrene on substrates via iCVD and bonded them at 50 °C for 24 h. Several researchers employed either an amine-functionalized silane reagent 14,17,19 or a methacrylate-functionalized silane reagent 16 as an adhesion promoter on thermoplastic surfaces and bonded it with PDMS after surface oxidation of both substrates.…”

Performance and mechanism of laser transmission joining between glass fiber‐reinforced PA66 and PC

“…Qin et al 5 used polymers for encapsulation of different micro elements, such as microelectrode units, remote sensing coil, structural membrane, and implantable sensors for packaging and coating. Jang et al 6 successfully connected two PC sheets through surface chemical modification to make sensor cell-arrays whose tensile strength was 0.55 MPa. Schmidt et al 7 studied the effect of long fiber-reinforced PA composite on laser joining.…”

“…Due to its high transparency, excellent mechanical property (young modulus: 2.0-2.4 GPa), high glass transition temperature (1458C), and good biocompatibility, PC is widely applied in MEMS, especially in micro fluidic components. 6 As for glass fiber-reinforced Polyamide 66 (GFR-PA66), it has high specific strength, good fatigue resistance, excellent vibration reduction performance, high temperature resistance, and easy for processing (low elasticity modulus). So, it is a promising kind of polymers in MEMS.…”