Polycrystalline silicon foils by flash lamp annealing of spray-coated silicon nanoparticle dispersions

Thermal processing in the subsecond range comprises modern, non-equilibrium annealing techniques which allow various material modifications at the surface without affecting the bulk. Flash lamp annealing (FLA) is one of the most diverse methods for short-time annealing with applications ranging from the classical field of semiconductor doping to the treatment of polymers and flexible substrates. It still continues to extend its use to other material classes and applications, and is becoming of interest for an increasing number of users. In this review we present a short, but comprehensive and consistent picture of the current state-of-the-art of FLA, sometimes also called pulsed light sintering. In the first part we take a closer look at the physical and technological background, namely the electrical and optical specifications of flash lamps, the resulting temperature profiles, and the corresponding implications for process-relevant parameters such as reproducibility and homogeneity. The second part briefly considers the various applications of FLA, starting with the classical task of defect minimization and ultrashallow junction formation in Si, followed by further applications in Si technology, namely in the fields of hyperdoping, crystallization of thin amorphous films, and photovoltaics. Subsequent chapters cover the topics of doping and crystallization in Ge and silicon carbide, doping of III-V semiconductors, diluted magnetic semiconductors, III-V nanocluster synthesis in Si, annealing of transparent conductive oxides and high-k materials, nanoclusters in dielectric matrices, and the use of FLA for flexible substrates.

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“…the application of multiple FLA steps with lower energy densities. Recently, this procedure was extended to foils [118].…”

Section: Several Aspects Of the Crystallization Of Thick Amorphousmentioning

confidence: 99%

A review of thermal processing in the subsecond range: semiconductors and beyond

Rebohle

Prucnal

Skorupa

2016

Semicond. Sci. Technol.

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“…USD combined with flash annealing allows for creating silicon structures, from porous layers to freestanding foils [206,207]. To illustrate this using, Si NP (15 nm) were mixed with organic solvents to strong agglomerations of the NP on the surface, moreover short flash annealing times increase the size of the covered area [206].…”

Section: Examples For Usdmentioning

confidence: 99%

A deep look into the spray coating process in real-time—the crucial role of x-rays

Roth

2016

J. Phys.: Condens. Matter

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Tailoring functional thin films and coating by rapid solvent-based processes is the basis for the fabrication of large scale high-end applications in nanotechnology. Due to solvent loss of the solution or dispersion inherent in the installation of functional thin films and multilayers the spraying and drying processes are strongly governed by non-equilibrium kinetics, often passing through transient states, until the final structure is installed. Therefore, the challenge is to observe the structural build-up during these coating processes in a spatially and time-resolved manner on multiple time and length scales, from the nanostructure to macroscopic length scales. During installation, the interaction of solid-fluid interfaces and between the different layers, the flow and evaporation themselves determine the structure of the coating. Advanced x-ray scattering methods open a powerful pathway for observing the involved processes in situ, from the spray to the coating, and allow for gaining deep insight in the nanostructuring processes. This review first provides an overview over these rapidly evolving methods, with main focus on functional coatings, organic photovoltaics and organic electronics. Secondly the role and decisive advantage of x-rays is outlined. Thirdly, focusing on spray deposition as a rapidly emerging method, recent advances in investigations of spray deposition of functional materials and devices via advanced x-ray scattering methods are presented.

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“…As flash curing exploits the transient heating phenomenon, expanding the photo processing technique to support ceramic film formation on substrates such as polyimide or polyethylene terephthalate (PET) may be possible. Also enabled by photonic curing, the formation of freestanding, 5-10-μm-thick polycrystalline Si sheets from nanoparticle solutions has demonstrated the ability not only to process materials on existing substrates, but to create entirely new scaffolds for circuit fabrication (76).…”

Section: Particle Sintering Through Postdeposition Thermal Treatmentmentioning

confidence: 99%

Additive Manufacturing of Hybrid Circuits

Sarobol¹,

Cook²,

Keicher³

et al. 2016

Annu. Rev. Mater. Res.

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There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

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Polycrystalline silicon foils by flash lamp annealing of spray-coated silicon nanoparticle dispersions

Cited by 7 publications

References 29 publications

A review of thermal processing in the subsecond range: semiconductors and beyond

A review of thermal processing in the subsecond range: semiconductors and beyond

A deep look into the spray coating process in real-time—the crucial role of x-rays

Additive Manufacturing of Hybrid Circuits

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