Polygenic risk score for early prediction of sepsis risk in the polytrauma screening cohort

Abstract

Background: Increasing genetic variants associated with sepsis have been identified by candidate-gene and genome-wide association studies, but single variant conferred minimal alterations in risk prediction. Our aimed to evaluate whether a weighted genetic risk score (wGRS) that aggregate information from multiple variants could improve risk discrimination of traumatic sepsis.Methods: 64 genetic variants potential relating to sepsis were genotyped in Chinese trauma cohort. Genetic variants with mean decrease accuracy (MDA) > 1.0 by random forest algorithms were selected to construct the multilocus wGRS. Area under curve (AUC) and Net reclassification improvement (NRI) were adopted to evaluate the discriminatory and reclassification ability of wGRS.Results: Seventeen variants were extracted to construct the wGRS in 883 trauma patients. The wGRS was significantly associated with sepsis after trauma (OR = 2.19, 95%CI = 1.53–3.15, P = 2.01 × 10− 5) after adjusted by age, sex, and ISS. Patients with higher wGRS have an increasing incidence of traumatic sepsis (Ptrend=6.81 × 10− 8), higher SOFA (Ptrend=5.00 × 10− 3) and APACHE II score (Ptrend=1.00 × 10− 3). The AUC of risk prediction model incorporating wGRS into the clinical variables was 0.768 (95%CI = 0.739–0.796), with an increase of 3.40% (P = 8.00 × 10− 4) versus clinical factors-only model. Furthermore, the NRI increased 25.18% (95%CI = 17.84–32.51%) (P = 6.00 × 10− 5).Conclusions: Our finding indicated that genetic variants could enhance the predictive power of risk model for sepsis and highlighted the application among trauma patients, suggesting that the sepsis risk assessment model will be a promising screening and prediction tool for high risk population.

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

“…According to the material, bumps can be divided into solder bumps and non-solder bumps. Solder bumps are mainly made of tin-based materials, including SnPb solder and lead-free solders such as SnCu, SnAg, and SnZn; non-solder bumps mainly include Au bumps, Cu bumps, and In bumps [13,14]. The main methods of micro bump preparation include electrodeposition, screen printing, solder injection and evaporation [15,16].…”