“…The shrinkage rates reported in previous work were 5.53, 5.74, and 4.81% in the LD, WD, and HD, respectively, over a thermal treatment time of 10 min. 32 In comparison, the shrinkage rates of PIAs-A2.6 herein were 8.85, 9.43, and 9.70% in the LD, WD, and HD, respectively, over a thermal treatment time of 40 min (Figure S4e). This result is mainly due to the introduction of Si−O−Si bonds, making the structure of PIAs-A2.6 more stable and resistant toward high temperature, and is consistent with the FESEM, mechanical properties, and TG data.…”