Polyimide Fibers with High Strength and High Modulus: Preparation, Structures, Properties, and Applications

Abstract

High strength and high modulus polyimide (HSHMPI) fibers are a type of novel high-performance organic fiber with an initial modulus higher than 90 GPa and extremely high tensile strength over 2.5 GPa realizing broad applications in the fields of electronic, engineering, aerospace, and atomic energy industries. There are currently two synthetic pathways, i.e., one-step and two-step methods, developed for the manufacture of HSHMPI fibers. An integrated fabrication process involving wet-spinning followed by thermal imidization is accepted as a typical two-step synthetic route for industrialization of HSHMPI fibers. In this article, the classification, synthetic method and technology, molecular structure, morphology, microstructures, and properties of HSHMPI fibers are summarized extensively. The effects of molecular structure and synthetic technology on the microstructures and overall performance of HSHMPI fibers are discussed. In addition, the trend in development and the application prospect of HSHMPI fibers are analyzed accordingly.

High Precision Fabrication Method of Fresnel Diffractive Lenses on Ultrathin Membrane for Imaging Application

“…Generally, spin-coating is a widely used method for coating uniform membranes on flat substrates, whose thickness can be accurately controlled between 30 nm and 30 μm. The thickness of each layer depends on several parameters, such as angular velocity, primary concentration, viscosity of solution, and solvent evaporability [13], [14]. According to the research, the relationship between thickness and angular velocity can be defined as Eq.…”

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

“…Polyimide (PI) is a well‐known engineering plastic that possesses excellent thermal stability, high chemical resistance, good mechanical properties as well as a low dielectric constant (low‐ k ) . Therefore, they have become an excellent candidate for microelectronics applications, such as interlayer dielectrics and flexible circuitry carriers .…”

Preparation and properties of high‐strength‐high‐modulus polyimide cords/natural rubber composites

“…[11][12][13] Recently, high-strength-high-modulus polyimide (PI) fibers have drawn tremendous attention because of their superior comprehensive properties including outstanding mechanical properties, good dimensional stability, preeminent thermal, and aging resistance, which can be certainly used as the reinforcements for cords/rubber composites. 14 Nevertheless, on account of their commercially unavailable, the applications of high-strengthhigh-modulus PI fibers as skeleton materials in rubber composites have seldom been touched. 15 In addition, good adhesion between cords and rubber is responsible for the overall properties of composites.…”

“…Therefore, high‐performance organic fibers, for example, aramid fibers and ultrahigh molecular weight polyethylene (UHMWPE) fibers, have been recognized as good candidates for tire cords due to their high tensile and impact strength, low density along with excellent toughness 11–13 . Recently, high‐strength‐high‐modulus polyimide (PI) fibers have drawn tremendous attention because of their superior comprehensive properties including outstanding mechanical properties, good dimensional stability, preeminent thermal, and aging resistance, which can be certainly used as the reinforcements for cords/rubber composites 14 . Nevertheless, on account of their commercially unavailable, the applications of high‐strength‐high‐modulus PI fibers as skeleton materials in rubber composites have seldom been touched 15 …”