Polymer Core BGA Vertical Stress Loading Analysis

Ehkan

et al. 2014

AMR

Self Cite

Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

Section: Resultsmentioning

confidence: 99%

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

Ehkan

et al. 2014

AMR

Self Cite

“…Next, the stress analysis was carried out using 10 node tetrahedral structural solid (SOLID 187) element for the 3D model. The contact regions in the 3D model defined using 3D 8 Node surface to surface contact (CONTA174) and 3D Target Segment (TARGE170) [15]. The result of junction temperature acquired from the thermal analysis was then utilized as an input for the stress analysis The end time was set to 10000s to monitor a steady-state in the output result.…”

Section: Methodsmentioning

confidence: 99%

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Vairavan

2013 7th Asia Modelling Symposium

et al. 2013

Self Cite

Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.

“…A design matrix was designed using full factorial design of experiment (DOE) with three factors and one response. The set of experimental combinations systematically study the variables that influence the quality of the grain size formed [8]. For spin coating speed, the low level value is 3000 rpm while high value is at 7000 rpm.…”

Section: Methodsmentioning

confidence: 99%

Grain Size Analysis on Ba0.65Sr0.35TiO3 Thin Films Using Design of Experiment

Vairavan

et al. 2014

AMR

Self Cite

This paper presents the relationship between spin coating speed, heat treatment time, and annealing temperature in response to the grain size in ferroelectric Barium Strontium Titanate (BST). Many fundamental issues such as heat conduction, contact deformation, mechanical stress, and friction can be explained and distinguished through the understanding of the grain size. The investigation was done using a full factorial design of experiment (DOE). Analysis was done quantitatively by plotting the main effects graphs. The results suggest that higher spin coating speed and the annealing temperature decreases the grain size while the heat treatment time is directly proportional to the value of grain size.