Polymer film formation in C2F6H2 discharges

d’Agostino, Riccardo; Cramarossa, F.; Fracassi, Francesco; Desimoni, E.; Sabbatini, Luigia; Zambonin, P. G.; Caporiccio, G.

doi:10.1016/0040-6090(86)90384-6

Cited by 86 publications

(53 citation statements)

References 14 publications

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“…The C1s spectrum was deconvoluted into five peaks (Fig. 8b) reports [45][46][47]. The XPS C1s spectra indicated that the surface of the PFE film (Fig.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Creation of superhydrophobic wood surfaces by plasma etching and thin-film deposition

Xie

Tang

et al. 2015

Surface and Coatings Technology

106

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“…The C1s spectrum was deconvoluted into five peaks (Fig. 8b) reports [45][46][47]. The XPS C1s spectra indicated that the surface of the PFE film (Fig.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Creation of superhydrophobic wood surfaces by plasma etching and thin-film deposition

Xie

Tang

et al. 2015

Surface and Coatings Technology

106

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“…Currently, such films are considered candidate materials to replace silicon dioxide as an interlayer dielectric in ultra large scale integration (ULSI) devices to reduce RC-delay, cross-talk, and power consumption. [1±5] Much work has been focused on the plasma-enhanced deposition of fluorocarbon thin films by many and varied precursors such as C 3 F 8 , [6] C 3 F 6 , [7] CF 4 /H 2 , [8] hexafluoropropylene oxide (HFPO), [9] C 2 F 6 /H 2 , [10] and many other fluorocarbon gases. Of particular interest is the versatile fluoroform (CF 3 H), a readily available gas that can be used in deep quartz etching, [11] deep silicon etching, [12] and in the deposition of fluorocarbon thin films by the use of a plasma CVD reactor.…”

mentioning

confidence: 99%

Plasma-Enhanced CVD of Fluorocarbon Thin Films via CF3H/H2 Chemistries

Senkevich

Tutor²,

Sherrer³

2000

Chem. Vap. Deposition

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Fluorocarbon thin films could possibly replace silicon dioxide as interlayer dielectrics in ULSI devices to reduce RC‐delay, cross‐talk, and power consumption. Fluoroform (CF3H) is a versatile gas for the preparation of such films and this work explores their deposition with the gas and varying volume fractions of hydrogen. The introduction of hydrogen leads to increased crosslinking, an enhanced value of the refractive index, a decrease in the advancing contact angle, and more scratch‐resistant films.

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“…The CF 2 component of the macromolecular structures is the dominant unit representing about 60% of all carbon-and fluorinebased functionalities. The presence of CF 3 and CF groups indicate that the plasma-induced molecular fragmentation processes are accompanied by defluorination and refluorination mechanisms. However, the small COC bond contribution allow us to suggest that the defluorination reactions, which could lead to the total removal of the fluorine atoms from some of the carbon atoms, have a very low intensity.…”

Section: Resultsmentioning

confidence: 97%

“…[3][4][5][6][7][8][9][10][11] The starting components include both monomericand nonmonomeric-type fluorocarbon derivatives. It has been shown that these approaches performed mainly by using continuous-wave (CW) PECVD techniques resulted in macromolecular layers with a stoichiometry where the F/C ratios were usually much lower than 2.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of Teflon-like macromolecular structures from dodecafluorocyclohexane and octadecafluorodecalin under RF-cold-plasma conditions

Dénès¹,

Hua²,

Simonsick³

et al. 1999

J. Appl. Polym. Sci.

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ABSTRACT:The chemical inertness, thermal stability, and low dielectric constant characteristics of polytetrafluoroethylene make this polymer very attractive for advanced technology applications. Current production technologies are not adequate for the deposition of often desired, thin-layer Teflon coatings. In this article the synthesis and characterization of Teflon-like macromolecular structures from dodecafluorocyclohexane and octadecafluorodecaline vapors under RF-cold-plasma conditions is discussed. It was demonstrated, based on high-resolution ESCA, ATR-FTIR, and LD-FT-ICR-MS investigations, that the deposited Teflon-like layers are built of CF, CF 2 , CF 3 , and ex situ origin COO groups with an over 60% fluorine content, and that they have a branched and/or crosslinked nature. These structures have a relatively high thermal stability (340°C) and are characterized by a low dielectric constant (2.1). Plasmaenhanced coatings of Teflon-like layers can be performed at room temperatures at large substrate areas.

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Polymer film formation in C2F6H2 discharges

Cited by 86 publications

References 14 publications

Creation of superhydrophobic wood surfaces by plasma etching and thin-film deposition

Creation of superhydrophobic wood surfaces by plasma etching and thin-film deposition

Plasma-Enhanced CVD of Fluorocarbon Thin Films via CF3H/H2 Chemistries

Synthesis and characterization of Teflon-like macromolecular structures from dodecafluorocyclohexane and octadecafluorodecalin under RF-cold-plasma conditions

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