Polymer integration for packaging of implantable sensors

Qin, Yiheng; Howlader, M. M. R.; Deen, M. Jamal; Haddara, Yaser M.; Selvaganapathy, P. Ravi

doi:10.1016/j.snb.2014.05.063

Cited by 142 publications

(68 citation statements)

References 284 publications

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“…For active implants requiring an energy source, wireless power transmission ultrasultra [60] or ultrasonic [61] links doubling as a data-communication path can be deployed as a wireless battery charger for critical/non-interruptible implants such as a pacemaker. Biocompatible materials such as Parylene and Liquid Crystal Polymer (LCP) [62] can be used to encapsulate the sensor implant. Implants capable of sensing post-surgical infection and monitoring tissue healing should be transient in nature and must be extracted without the need for re-operative intervention.…”

Section: From Wearables To Implantablesmentioning

confidence: 99%

From Wearable Sensors to Smart Implants-–Toward Pervasive and Personalized Healthcare

Andreu-Pérez

Leff

et al. 2015

IEEE Trans. Biomed. Eng.

311

156

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Abstract-Objective:This article discusses the evolution of pervasive healthcare from its inception for activity recognition using wearable sensors to the future of sensing implant deployment and data processing. Methods: We provide an overview of some of the past milestones and recent developments, categorised into different generations of pervasive sensing applications for health monitoring. This is followed by a review on recent technological advances that have allowed unobtrusive continuous sensing combined with diverse technologies to reshape the clinical workflow for both acute and chronic disease management. We discuss the opportunities of pervasive health monitoring through data linkages with other health informatics systems including the mining of health records, clinical trial databases, multi-omics data integration and social media. Conclusion: Technical advances have supported the evolution of the pervasive health paradigm towards preventative, predictive, personalised and participatory medicine. Significance: The sensing technologies discussed in this paper and their future evolution will play a key role in realising the goal of sustainable healthcare systems.Index Terms-pervasive health, wearable sensors, implantable sensors, health informatics.

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Section: From Wearables To Implantablesmentioning

confidence: 99%

From Wearable Sensors to Smart Implants-–Toward Pervasive and Personalized Healthcare

Andreu-Pérez

Leff

et al. 2015

IEEE Trans. Biomed. Eng.

311

156

View full text Add to dashboard Cite

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“…The materials that can be used in medical implants are limited by the constraints of biocompatibility. In many cases, coating layers are applied, such as polymers, parylene, PEEK (polyether ether ketone) or graphene [92][93][94][95] . A number of metals can also be used (depending on the location of the device), such as platinum, titanium, and TiN.…”

Section: Medical Implant/cathetersmentioning

confidence: 99%

“…An overview of the important issues with metals, ceramics, and polymers is given in Table 7 (Ref. 94).…”

Section: Medical Implant/cathetersmentioning

confidence: 99%

Precision in harsh environments

2016

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Microsystems are increasingly being applied in harsh and/or inaccessible environments, but many markets expect the same level of functionality for long periods of time. Harsh environments cover areas that can be subjected to high temperature, (bio)-chemical and mechanical disturbances, electromagnetic noise, radiation, or high vacuum. In the field of actuators, the devices must maintain stringent accuracy specifications for displacement, force, and response times, among others. These new requirements present additional challenges in the compensation for or elimination of cross-sensitivities. Many state-of-the-art precision devices lose their precision and reliability when exposed to harsh environments. It is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low maintenance. The next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design, materials, device functionality, and packaging. All of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these challenges. The main areas of importance are in the fields of materials science, micro/nano-fabrication technology, device design, circuitry and systems, (first-level) packaging, and measurement strategy. This study examines the challenges presented by harsh environments and investigates the required approaches. Examples of successful devices are also given.

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“…Many bonding technologies used in the fabrication and assembly of Si-based micro-optical systems use high temperature, high pressure, vacuum bonding chamber, and thick adhesives [74]. These technologies may degrade the materials on the substrates (e.g., polymer), increase process and assembly costs, require complicated equipment (e.g., ultra-high vacuum bonder for vacuum seal), and sometimes be incompatible with biological specimens.…”

Section: Wafer Bonding For Electrical and Optical Interfacesmentioning

confidence: 99%

“…One possible solution to address this temperature related issue is to employ the SAB technologies [54,74,97]. The SAB technologies join two clean, smooth and activated surfaces using the adhesion force of surface atoms at room temperature or at low temperatures.…”

Section: Surface Activated Bondingmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

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Abstract:Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts the system's performance. These systems also have to be low-cost, densely integrated and compatible with current and future mainstream technologies for electronic-photonic integration. To address these issues, proper selection of the fabrication, integration and assembly technologies is needed. In this paper, wafer level bonding with advanced features such as surface activation and passive alignment for vertical electrical interconnections are identified as candidate technologies to integrate different electronics, optical and photonic components. Surface activated bonding, superior to other assembly methods, enables low-temperature nanoscaled component integration with high alignment accuracy, low electrical loss and high transparency of the interface. These features are preferred for the hybrid integration of silicon-based micro-opto-electronic systems. In future, new materials and assembly technologies may emerge to enhance the performance of these micro systems and reduce their cost. The article is a detailed review of bonding techniques for electronic, optical and photonic components in silicon-based systems.

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Polymer integration for packaging of implantable sensors

Cited by 142 publications

References 284 publications

From Wearable Sensors to Smart Implants-–Toward Pervasive and Personalized Healthcare

From Wearable Sensors to Smart Implants-–Toward Pervasive and Personalized Healthcare

Precision in harsh environments

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

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