Polymer optical interconnect technologies for polylithic gigascale integration

Mule, A.V.; Joseph, P. J. Amal; Allen, Sue Ann Bidstrup; Kohl, Paul A.; Gaylord, Thomas K.; Meindl, J.D.

doi:10.1109/essderc.2003.1256825

Cited by 3 publications

(8 citation statements)

References 3 publications

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“…As Avatrel 2580-20 seemed to be a good choice of material from the processing perspective, a loss coefficient measurement was performed using the image capture method [66]. First, a ∼30 µm-thick film of polymer was spun onto a piece of Si.…”

Section: Optical Loss Measurement In Avatrel 2580-20mentioning

confidence: 99%

“…Here, Λ denotes the grating period, and φ is the grating slant angle. The slant in the periodic variation of the refractive index in the VGC is responsible for the preferential coupling (either towards or away from the substrate) [66]. VGCs can also be designed to focus the out-coupled beam.…”

Section: Volume Grating Couplersmentioning

confidence: 99%

“…As the fabrication of the VGCs does not require any etching (and associated processing), it is simpler to realize than a surface-relief grating. The optical design of grating-in-waveguide interconnects is described in detail in [66].…”

Section: Volume Grating Couplersmentioning

confidence: 99%

“…Then, for the set of materials listed above, and for wavelength Table 6.1. The complete grating design procedure as well as efficiency calculations can be found in [66]. Photoemitters and photodetectors could be directly integrated onto the probe substrate.…”

Section: Volume Grating Couplersmentioning

confidence: 99%

“…Lowtemperature deposition is essential as higher temperatures would have an adverse effect on the grating photopolymer. The oxide film is also critical for adhesion between the grating polymer and Avatrel 2190P polymer from Promerus, LLC, which has been shown to be a suitable waveguide material [96]. The propoagation loss of Avatrel 2190 waveguides has been measured to range between 0.78-7.39 dB/cm [66].…”

Section: Waveguidesmentioning

confidence: 99%

See 4 more Smart Citations

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Thacker

Ogunsola

Bakir

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

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The bandwidth provided by optical interconnects makes them an attractive solution for chip-to-package and chip-to-chip communications. In such systems, chips will have optical I/O interconnects fabricated alongside their conventional electrical counterparts. Virtually no work has been previously reported relating to the testing of such chips at the wafer-level. The requirements for probe hardware needed to achieve this are identified, and probe module configurations based on these requirements are presented. A high-density micro-opto-electro-mechanical-systems (MOEMS)-based probe substrate prototype for interfacing with chips having electrical and optical polymer pillar-based I/Os has been designed, and built using microfabrication techniques. Successful probing of an array of polymer pillar-based optical I/Os is reported.

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Section: Optical Loss Measurement In Avatrel 2580-20mentioning

confidence: 99%

Section: Volume Grating Couplersmentioning

confidence: 99%

Section: Volume Grating Couplersmentioning

confidence: 99%

Section: Volume Grating Couplersmentioning

confidence: 99%

Section: Waveguidesmentioning

confidence: 99%

See 3 more Smart Citations

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Thacker

Ogunsola

Bakir

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

View full text Add to dashboard Cite

show abstract

Wafer-Testing of Optoelectonic–Gigascale CMOS Integrated Circuits

Thacker

Ogunsola

Muler

et al. 2011

IEEE J. Select. Topics Quantum Electron.

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Fabrication of Multifunctional Optical I/O via Imprint Lithography

Allen

Kohl

2004

Electrochem. Solid-State Lett.

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Physical relief features are important for the fabrication of nanometer-scale optical features. In this paper, a new fabrication method is described to form high aspect ratio, complex structures. This fabrication method combines nano-imprint lithography and photolithography together, to produce macro-scale features with micro-scale structures on them in a single process sequence, with one ultraviolet exposure step. The imprint step used a prefabricated stamp to directly emboss the photosensitive polymer prior to ultraviolet exposure without affecting the photosensitivity of the polymer. A temporary glass layer was deposited over the imprinted structure to preserve the fine features so that the large-scale photodefinition process could be completed. Diffractive grating features were photodefined on top of polymer pillars.

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Polymer optical interconnect technologies for polylithic gigascale integration

Cited by 3 publications

References 3 publications

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Wafer-Testing of Optoelectonic–Gigascale CMOS Integrated Circuits

Fabrication of Multifunctional Optical I/O via Imprint Lithography

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