“…However, since the pressure that must be applied is at least one order of magnitude higher than the one used in a conventional T-NIL, and the pattern cavities in the mold cannot be completely filled during the RT process when thermoplastic materials are used, the achievable imprinting depths are generally lower (typically less than 150 nm) and the quality of the transfer is generally poorer [18]. This fabrication method has been employed to obtain DFB devices [22][23][24], but due to these problems their performance is often limited, i.e. high laser thresholds, no precise control in the emission wavelength given certain fabrication parameters, poor photostability, etc.…”