1997
DOI: 10.1049/el:19970881
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Polymeric optical waveguide films with 45°mirrors formed with a 90° V-shaped diamond blade

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Cited by 44 publications
(6 citation statements)
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“…• V-shaped diamond blade 5,6 can provide an excellent cut surface, but it is difficult to cut individual waveguides on the same substrate due to the physical size of the machining tool. Reactive ion etching 7 where the slope of the mirror is formed by 45…”
Section: Introductionmentioning
confidence: 99%
“…• V-shaped diamond blade 5,6 can provide an excellent cut surface, but it is difficult to cut individual waveguides on the same substrate due to the physical size of the machining tool. Reactive ion etching 7 where the slope of the mirror is formed by 45…”
Section: Introductionmentioning
confidence: 99%
“…A critical and relatively unsolved issue consists of the efficient coupling of light to and from PCB-integrated waveguides. The most commonly used approach is the use of 45 • micro-mirrors, which are generally directly integrated in the PCB-embedded waveguides (Glebov et al, 2005;Hendrickx et al, 2007;a;Yoshimura et al, 1997). To enhance the coupling efficiency when using waveguide-integrated micro-mirrors, we investigated a pillar-assisted coupling scheme, in which an optical micro-pillar is placed between a surface-mounted laser/detector and an out-of-plane coupling micro-mirror to compensate for differences in thermal expansion of the materials (Glebov et al, 2006).…”
Section: Coupling Structures For Printed Circuit Board-level Optical mentioning
confidence: 99%
“…In the case of power monitoring on integrated optical components (where only part of the channels need to be terminated) the use of such costly substrates can not be justified and a Si wafer board based hybrid integration approach is preferable. For this purpose, the definition of an out-of-plane coupling structure into the polymeric layer stack is required for which several methods have been reported, including laser ablation [15]- [16], microtoming [17], embossing [18], focused ion beam etching [19], sawing [20], and injection molding [21]. Because of the poor reproducibility or requirement of complicated equipment of these techniques, we have developed a novel integration concept [22] based on a micromachined Si submount with an integrated mirror (Fig.…”
Section: Pd Integration Conceptmentioning
confidence: 99%