Polymerization study and rheological behavior of a RTM6 epoxy resin system during preprocessing step

Caussé, Nicolas; Benchimol, Stephanie; Martineau, Lilian; Carponcin, Delphine; Lonjon, Antoine; Fogel, Mathieu; Dandurand, Jany; Dantras, Éric; Lacabanne, C.

doi:10.1007/s10973-014-4147-y

Cited by 15 publications

(2 citation statements)

References 27 publications

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“…In the case of carbon black, the amount to obtain percolation threshold is about 15% in volume which decreases mechanical properties. Sandler et al ., Barrau et al ., and Causse et al . have introduced carbon nanotubes (CNTs) in epoxy polymer matrix.…”

Section: Introductionmentioning

confidence: 99%

Influence of silver nanowires on thermal and electrical behaviors of a poly(epoxy) coating for aeronautical application

Bedel

Lonjon

Dantras

et al. 2018

J of Applied Polymer Sci

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Thermal and electrical behaviors of a poly(epoxy) coating with high electrical conductivity used for aeronautic applications are investigated. The poly(epoxy) used is designed for resin transfer molding (RTM) applications, it have a low viscosity at room temperature (around 1 Pa s) and a high T g (>160 C). This study details the influence of silver nanowires with a high aspect ratio, on the thermal behavior such as the relative degree of reaction α and the kinetics parameters thanks to dynamic and isothermal differential scanning calorimetry. Conductivity measurements of surface and volume have permitted to determine a very low percolation threshold at around 0.7% in volume. The value of electrical conductivity above the percolation threshold is upper than 10 2 S m −1 and the lowest surface resistivity was measured around 13 mΩ sq −1 both for 8% in volume of AgNWs. This kind of coating has a great interest for lightning strike protection of aircraft parts due to the high electrical conductivity obtained with a low overweight.

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Section: Introductionmentioning

confidence: 99%

Influence of silver nanowires on thermal and electrical behaviors of a poly(epoxy) coating for aeronautical application

Bedel

Lonjon

Dantras

et al. 2018

J of Applied Polymer Sci

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“…The curing process of RMT6 is an exothermic reaction [4]. Therefore the resistive structure inside the RTM6 measures the additional heat of the reaction.…”

Section: Resultsmentioning

confidence: 99%

Online Monitoring of Composites with a Miniaturized Flexible Combined Dielectric and Temperature Sensor

Hübner

Lang

2017

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

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We present a foil based miniaturized impedance sensor combined with a temperature sensitive structure to be integrated in Carbon-Fiber-Reinforced-Polymer (CFRP). Commercially available sensors are too big and they weaken the CFRP. In contrast the influence of our miniaturized flexible sensor can be neglected due to its size (5 µ m thick); it is in the range of the fibers' diameter. The sensor can remain in the produced part without disruption and even be used for structural health monitoring. Our sensor will enable automated control of the curing process and improve the fabrication. This is the first time impedance and temperature sensing is combined in such a small size.

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Influence of cure kinetic, rheological and thermo-mechanical behavior on micro-level curing strain of an epoxy prepreg

Ganapathi

Joshi

Chen

2015

J Therm Anal Calorim

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Polymerization study and rheological behavior of a RTM6 epoxy resin system during preprocessing step

Abstract: OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible.

Cited by 15 publications

References 27 publications

Influence of silver nanowires on thermal and electrical behaviors of a poly(epoxy) coating for aeronautical application

Influence of silver nanowires on thermal and electrical behaviors of a poly(epoxy) coating for aeronautical application

Online Monitoring of Composites with a Miniaturized Flexible Combined Dielectric and Temperature Sensor

Influence of cure kinetic, rheological and thermo-mechanical behavior on micro-level curing strain of an epoxy prepreg

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