Polymers with Heterocyclic Rings in the Chain

Critchley, J. P.; Knight, G. J.; Wright, W. W.

doi:10.1007/978-1-4899-0396-9_5

Cited by 3 publications

(2 citation statements)

References 142 publications

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“…One of the main requirements is the processability of the polymer into a continuous thin film (<12 μm thickness), since the capacitance scales inversely with film thickness [14]. This limitation precludes the use of Kapton® polyimide as a capacitor dielectric [15], even though it has been used extensively as wire and cable insulation for aircraft with a continuous operating temperature of 300-350°C since the early 1980s [16][17][18].…”

Section: Figurementioning

confidence: 99%

“…In the early 1990s, the lack of suitable high temperature polymer film capacitors prompted a concerted effort funded by NASA and the U.S. Air Force to develop new capacitor dielectrics based on commercially available heat-resistant polymers with operating temperatures above 200°C. While Kapton® polyimide has been used extensively since the early 1980s as wire and cable insulation for aircraft (continuous operating temperature of 300-350°C [16][17][18]), it has never been used as a capacitor dielectric due in part to its previous inability to be manufactured in thin films. Nevertheless, it is a common benchmark for development of new dielectrics.…”

Section: Commercial Polyimides Evaluated For Capacitor Applicationsmentioning

confidence: 99%

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Polyimides as High Temperature Capacitor Dielectrics

Ho¹,

Schroeder²

2021

Polyimide for Electronic and Electrical Engineering Applications

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Nearly five decades of effort has focused on identifying and developing new polymer capacitor films for higher-than-ambient temperature applications, but simultaneous demands of processability, dielectric permittivity, thermal conductivity, dielectric breakdown strength, and self-clearing capability limit the number of available materials. Demands on these criteria are even more stringent in growing numbers of applications demanding high power performance. Aromatic polyimides, though not a panacea, are a class of heat-resistant polymers of great interest to researchers as capacitor dielectrics because of good thermal and mechanical stability. In this chapter, the key aspects and advantages of metallized polymer film capacitors are compared to analogous alternative technologies (polymer-film-metal-foil, ceramic, and electrolytic capacitors), followed by a comprehensive review of commercial resin development leading up to recent research on polyimides targeted for operating temperature above 150°C. Finally, this chapter provides a brief discussion on the recent effort on combining computation and synthesis to design polymers with desirable dielectric properties.

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Section: Figurementioning

confidence: 99%

Section: Commercial Polyimides Evaluated For Capacitor Applicationsmentioning

confidence: 99%

Polyimides as High Temperature Capacitor Dielectrics

Ho¹,

Schroeder²

2021

Polyimide for Electronic and Electrical Engineering Applications

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High‐Temperature‐Resistant Polymer Nanocomposites

Zope

Dasari

2016

Functional and Physical Properties of Polymer Nanocomposites

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Synthesis and Properties of an Addition-type Imide Oligomer having Pendent Phenylethynyl Groups: Investigation of Curing Behavior

Sasaki

Yokota

2006

High Performance Polymers

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A phenylethynyl-terminated imide oligomer having pendent phenylethynyl groups (20 mol%) was synthesized using a novel pendent diamine, 2,4-diamino-1-(1-fluoro-4-phenylethynylphenoxy) benzene. The imide oligomer exhibited excellent solubility in NMP and solutions up to 40% solids were obtainable. A detailed cure study was performed on the oligomer by staged heating to final cure temperatures of 370, 400, 420, and 450 C. Complete cure was accomplished by heating at 450 C for 10 min. In comparison phenylethynyl terminated oligomers typically require curing for 1 h or more at 370 C. The cure reaction was studied using DSC by following the disappearance of exothermic peak corresponding to the cleavage of the triple bond (i.e. phenylethynyl group). DMA showed an increase in T g and a decrease in the drop of storage modulus ( E) with increasing post-cure temperature. Likewise, thin film tensile specimens exhibited a decrease in the elongation to break with increasing post-cure temperature. Post-cure time (370 C for 1 and 2 h) did not achieve full cure.

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Polymers with Heterocyclic Rings in the Chain

Cited by 3 publications

References 142 publications

Polyimides as High Temperature Capacitor Dielectrics

Polyimides as High Temperature Capacitor Dielectrics

High‐Temperature‐Resistant Polymer Nanocomposites

Synthesis and Properties of an Addition-type Imide Oligomer having Pendent Phenylethynyl Groups: Investigation of Curing Behavior

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