Traditionally, implantable electronic devices have used metal-based hermetic encapsulation to protect the internal components from damage by the aggressive in vivo environment. Concurrently, hermetic encapsulation protects the surrounding tissue from harmful substances that might be leached from the packaged components (Bazaka & Jacob, 2012). In some cases, however, there is risk of electrochemical corrosion on the metallic surfaces because of the presence of various ions, amino acids, proteins and dissolved oxygen (Eliaz, 2019). Hermeticity is defined as the ability of sealed packages to resist foreign gases and liquids from penetrating the seal or encapsulating material (Madduri, Sammakia, Infantolino, & Chaparala, 2008). Hermetic packages are conventionally made from glass, metal or ceramic materials whereby the gas and moisture permeability through the material is negligible (Madduri et al., 2008; Schuettler, Schatz, Ordonez, & Stieglitz, 2011). Hermetic materials have been successfully used to package devices for chronic applications, some of the most notable being cochlear implants and cardiac pacemakers (Kirsten, Wetterling, Uhlemann, Wolter, & Zigler, 2013). Titanium is the most commonly used metal for hermetic encapsulation because of its biocompatibility, low permeability for ions and moisture, mechanical durability and the ability to create viable hermetic seals by laser welding (Amanat, James, & McKenzie, 2010). Ceramics have also been used for implants for wireless devices to address issues related to attenuation of electromagnetic transmission by metallic packaging (El Khatib, Pothier, Crunteanu, & Blondy, 2007; Schubring & Fujita, 2007; Shen & Maharbiz, 2019). Driven by the increased functionality and scalability offered by innovations in application-specific integrated circuits (ASICs) and the desire to create highly miniaturized devices on flexible polymer substrates, significant efforts have been made in creating miniaturized implants by integrating the majority of components on a single chip. As the