2018
DOI: 10.1016/j.polymertesting.2018.06.012
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Poss-containing nanocomposites based on polyurethane/poly(hydroxypropyl methacrylate) polymer matrix: dynamic mechanical properties and morphology

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Cited by 13 publications
(3 citation statements)
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“…As the mixing temperature increasing from 25 to 50 °C, the gelation time of low viscosity PH-50 extends and then reduces in Figure 3 b. The higher the mixing temperature, the lower the viscosity and the faster the reaction of the mixture due to the thermally initiated polymerization of HPMA [ 24 ]. At 30 °C, it is possible to obtain an ideal PU prepolymer for blade infusion with both low viscosity (<600 MPa·s) and a long filling time (>120 min).…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…As the mixing temperature increasing from 25 to 50 °C, the gelation time of low viscosity PH-50 extends and then reduces in Figure 3 b. The higher the mixing temperature, the lower the viscosity and the faster the reaction of the mixture due to the thermally initiated polymerization of HPMA [ 24 ]. At 30 °C, it is possible to obtain an ideal PU prepolymer for blade infusion with both low viscosity (<600 MPa·s) and a long filling time (>120 min).…”
Section: Resultsmentioning
confidence: 99%
“…There are many ways to extend the gelation time of PU to obtain the dense cross-linking structure, such as adjusting the ambient temperature, increasing the molecular weight of the soft segment and adding some materials to slow down the reaction [ 22 , 23 ]. Among them, reacting PU prepolymers with some special monomers should be an effective option [ 24 ]. The monomer used for the reaction should have polymeric groups and the ability to react with isocyanate.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4] In the absence of catalyst catalysis, the EP cannot be cured, so the type and amount of the curing agent largely determine the properties of the EP. Currently commonly used curing agents are polar, such as anhydride, 5 imidazole, 6 thiol, 7 and amine, 8 etc., need to add a large amount of curing agent when curing, and the dielectric properties are not good enough. So, EP is intended to be a low dielectric material for very large-scale integrated circuits and semiconductors, but is limited by relatively high dielectric constant.…”
Section: Introductionmentioning
confidence: 99%