Possible failure modes in Press-Pack IGBTs

Tinschert, Lukas; Årdal, Atle Rygg; Poller, Tilo; Bohlländer, Marco; Hernes, Magnar; Lutz, Josef

doi:10.1016/j.microrel.2015.02.019

Cited by 57 publications

(18 citation statements)

References 9 publications

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“…A conclusion is made in [112] that the internal pressure increases and decreases during power cycling and temperature cycling, which could lead to possible fatigue for those press-pack packaging. Further, [117] explained that two possible failure mechanisms of the press-pack structure are micro-electrical discharge and damage of the gate oxide. Besides, vibration can also affect the stability of clamping pressure.…”

Section: Press-pack Packagingmentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Section: Press-pack Packagingmentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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“…The VSC‐HVDC used press‐pack IGBT device is composed of many independent sub‐modules inside as reported in [6]. From top to bottom every sub‐module include collector copper plate, collector molybdenum layer ( C m layer), IGBT chip, emitter molybdenum layer ( E m layer), silver gasket, and grid probe, on the IGBT chip both sides have a very thin layer of aluminium.…”

Section: Physical Field Modelling Of Press‐pack Igbtmentioning

confidence: 99%

Modelling and analysis on short‐circuit failure for press‐pack IGBT devices used in VSC‐HVDC converter

Yao

Lai

et al. 2019

J. eng.

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“…Studies in [41] showed that press-pack IGBTs have improved lifetime performance compared to the flat-pack IGBTs. However, [42] found early failures that could be attributed to damaged gateoxide and micro-eroding. The press-pack also addresses the solder fatigue failure mechanism.…”

Section: A Component Reliability -Power Module Levelmentioning

confidence: 99%

A Review of Methods to Increase the Availability of Wind Turbine Generator Systems

Shipurkar¹,

Polinder²,

Ferreira³

2016

CPSS TPEA

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Abstract-Availability is an important factor to be considered when designing wind turbine generator systems. The quest for increased availability is based on the following five design approaches -design for component reliability, active control for reliability, design for fault tolerance, prognostics, and design for maintainability. This paper reviews methods focussing on the first three, i.e. component reliability, active control, and fault tolerance. The paper further identifies some promising directions for further research.

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Possible failure modes in Press-Pack IGBTs

Cited by 57 publications

References 9 publications

Automotive Power Module Packaging: Current Status and Future Trends

Automotive Power Module Packaging: Current Status and Future Trends

Modelling and analysis on short‐circuit failure for press‐pack IGBT devices used in VSC‐HVDC converter

A Review of Methods to Increase the Availability of Wind Turbine Generator Systems

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