1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
DOI: 10.1109/ectc.1999.776339
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Post-weld-shift in semiconductor laser packaging

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Cited by 8 publications
(5 citation statements)
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“…For example, the laser beam delivered from the Nd:YAG laser to the workpiece were adjusted to an incident angle of 45 • in the cylindrical-type or dual-in line package (DIP) [6][7][8] and the incident is 30 • in the butterfly package [9] of the light-wave communication system. During the laser welding process for optoelectronic packaging, rapid cooling of solid phase and associated material shrinkage often cause a post weld shift (PWS) between the welded parts [5][6][7][8][9]. In case that the PWS induced by laser welding is a few micrometers, about 50% loss in coupled power will be incurred, resulting in performance degradation of the packaged components.…”
Section: Introductionmentioning
confidence: 99%
“…For example, the laser beam delivered from the Nd:YAG laser to the workpiece were adjusted to an incident angle of 45 • in the cylindrical-type or dual-in line package (DIP) [6][7][8] and the incident is 30 • in the butterfly package [9] of the light-wave communication system. During the laser welding process for optoelectronic packaging, rapid cooling of solid phase and associated material shrinkage often cause a post weld shift (PWS) between the welded parts [5][6][7][8][9]. In case that the PWS induced by laser welding is a few micrometers, about 50% loss in coupled power will be incurred, resulting in performance degradation of the packaged components.…”
Section: Introductionmentioning
confidence: 99%
“…We aim to obtain a lateral alignment accuracy of < 0.1 µm for an acceptable insertion loss. The bottleneck in achieving this accuracy in present solutions is especially the fixation process and not the active alignment process itself [5], [6]. Adhesives are prone to shrinkage during or after the curing process, which causes misalignment after the final bonding step.…”
Section: Proposed Optical Fiber Array Conceptmentioning
confidence: 99%
“…2 depicts a typical butterfly laser package [5], [6], composed of a single-mode fiber, a thermoelectric cooler (TEC), an optical subassembly-which is the platform onto which the laser diode and some of the other components are mounted-and the clip, which provides the welding interface between the fiber ferrule and the weld platform on the optical subassembly [7]. The tip of the fiber is encapsulated in a cylindrical metallic fiber ferrule.…”
Section: A Package Constructionmentioning
confidence: 99%