2015
DOI: 10.1585/pfr.10.3405035
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Potential of Copper Alloys using a Divertor Heat Sink in the Helical Reactor FFHR-d1 and their Brazing Properties with Tungsten Armor by using the Typical Candidate Filler Materials

Abstract: A tungsten block is supposed to be used as a divertor armor material on the helical reactor FFHR-d1. On the other hand, material selection of the heat sink and bonding technique between armor and heat sink are currently under investigation. On the material selection, copper alloy has a large advantage for the thermal conductivity, but its material properties such as toughness and thermal conductivity, are dramatically decreased due to the neutron irradiation. However, from the assessment of the neutronics envi… Show more

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Cited by 13 publications
(15 citation statements)
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“…Due to such surface corrosion, particularly in ambient air, bonding at too high pressure for long duration may rather weaken the mechanical bonding strength. We have thus obtained W/Cu bonding in ambient air at a temperature of 500 • C, significantly lower than those of earlier studies [7,8,15], about 1000 • C. The mechanical bonding strength of our samples, about 1 MPa, was however far lower than the state-of-theart reported values, over 100 MPa. This weakness issue is to be resolved.…”
Section: Resultscontrasting
confidence: 74%
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“…Due to such surface corrosion, particularly in ambient air, bonding at too high pressure for long duration may rather weaken the mechanical bonding strength. We have thus obtained W/Cu bonding in ambient air at a temperature of 500 • C, significantly lower than those of earlier studies [7,8,15], about 1000 • C. The mechanical bonding strength of our samples, about 1 MPa, was however far lower than the state-of-theart reported values, over 100 MPa. This weakness issue is to be resolved.…”
Section: Resultscontrasting
confidence: 74%
“…Whilst, these characteristics are seemingly not very sensitive to the bonding temperature for the Cu side. Overall, although W/Cu bonds formed even at a temperature as low as 500 • C and a bonding pressure as low as 0.1 MPa, the resulted interfacial mechanical strength is quite low relative to those obtained by the state-of-the-art techniques such as high-temperature brazing [7,8]. While bonding in ambient air is practically convenient, the technical trade-off with the oxidation issue has to be accounted for, depending on the requirement of each situation.…”
Section: Resultsmentioning
confidence: 81%
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“…Since the recrystallization temperature of tungsten armor tiles is 1500 to 1800 K [11][12][13], it is desirable that the armor tar surface temperature during operation be maintained below this temperature range.…”
Section: Divertor Optimization Designmentioning
confidence: 99%
“…It has been pointed out that in the actual divertor, material deterioration occurs when it is exposed to heavy neutron irradiation of 14 MeV with a high heat load. In particular, it has been pointed out that the ODS material causes significant deterioration in characteristics that interferes with long-term operation when exposed to irradiation of about 20 dpa within the expected operation period [3,[9][10][11][12][13].…”
Section: Cooling Performance Evaluation Of High Radiation Compatible ...mentioning
confidence: 99%