1977
DOI: 10.1109/irps.1977.362797
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Power Transistor Crystal Damage in Inductive Load Switching: A Reliability Concern

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Cited by 7 publications
(4 citation statements)
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“…Experimental studies reported in Ref. [16] have shown that the crystal damage is at the n -n C interface under the center of the emitter as the device is subjected to high voltage and high current operating conditions. It is believed from Ref.…”
Section: Comparison With Experimental Resultsmentioning
confidence: 99%
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“…Experimental studies reported in Ref. [16] have shown that the crystal damage is at the n -n C interface under the center of the emitter as the device is subjected to high voltage and high current operating conditions. It is believed from Ref.…”
Section: Comparison With Experimental Resultsmentioning
confidence: 99%
“…It is believed from Ref. [16] that the crystal damage is due to local heating. Figure 9 is the cross-sectional view of the device showing the defect location.…”
Section: Comparison With Experimental Resultsmentioning
confidence: 99%
“…Internal crystal damage has been observed in a power transistor with design parameters of Table 2, after on / off switching in a circuit with an inductive load. Infrared scanning and cross-sectioning and visual inspection of the chip revealed the crystal damage at the n--n+ interface under the center of the emitter [27]. The transistor, however, showed no degradation in electrical parameters after about 1000 hours of operation.…”
Section: For a Constant Current Level And Different Values Of V Cb 'mentioning
confidence: 98%
“…The diameter of the defect is about 38 JLm (1.5 mil). It is believed [27] that the crystal damage is due to local heatditions. For "on" conditions where the V CB is small (a few volts) and the current through the device is high (4 -5 A), the electric field peaks at the n--n+ interface, as seen from Fig.…”
Section: For a Constant Current Level And Different Values Of V Cb 'mentioning
confidence: 99%