Pre-bonding technology based on excimer laser surface treatment

Rotel, M.; Zahavi, J.; Tamir, S.; Buchman, A.; Dodiuk, H.

doi:10.1016/s0169-4332(99)00384-0

Cited by 48 publications

(19 citation statements)

References 10 publications

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“…A high adhesion of a metal layer is supported by a micro structure on the surface. This can be realized by plasma etching, chemical etching, laser etching or mechanical etching, e.g., with sandblasting [24][25][26]. There are other processes in use, but all of them require an additional processing step.…”

Section: Introductionmentioning

confidence: 99%

Selective Grafting of Polyamines to Polyether Ether Ketone Surface during Molding and Its Use for Chemical Plating

et al. 2018

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We present a new approach of surface functionalization of polyether ether ketone (PEEK) that is carried out during the molding step. Thin films of polymers with different functional groups were applied to the surface of a mold and brought in close contact with a PEEK melt during injection molding. The surfaces of the produced parts were characterized after solidification. Only those PEEK surfaces that were in contact with polymers bearing primary amino groups exhibited a wettability for water. Obviously, the thin polymer film was grafted to the surface by a chemical reaction initiated by the high melt temperature. The formation of azomethine bonds between PEEK and the polyamine by coupling to the ketone groups was proposed. The other amino groups in the molecule were still in function after the molding process. They adsorbed different anionic molecules and anionic charged nanoparticles from aqueous solutions. The surfaces could be chemically plated by copper and nickel with high adhesion.

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Section: Introductionmentioning

confidence: 99%

Selective Grafting of Polyamines to Polyether Ether Ketone Surface during Molding and Its Use for Chemical Plating

et al. 2018

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“…This result is consistent with other reports of Excimer laser ablation of unconfined PEEK. 16,17 C. Teflon-assisted debonding…”

Section: B Debondingmentioning

confidence: 99%

Laser ablation of polyetheretherketone films for reversible wafer bonding

Rohwer

Martin

Friedmann

et al. 2012

Journal of Laser Applications

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A reversible wafer bonding method has been developed that enables high-temperature processing of thinned silicon wafers. The silicon wafers are bonded to Pyrex carriers using a polyetheretherketone (PEEK) film, which melts at 343 °C, and provides a very strong bond. Debonding is accomplished by UV laser ablation through the Pyrex carrier and can be facilitated by coating the Pyrex wafer with Teflon. Most of the PEEK film remains on the silicon wafer after debonding and is removed with solvents. Precoating the silicon with germanium/tetraethyl orthosilicate (TEOS) might enable PEEK removal without solvents. This germanium/TEOS layer lifts off with the PEEK film during laser ablation.

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“…Previous research using laser irradiation to alter surface topography for adhesion promotion has been conducted using nonspecific ablation processes relying on differences in ablation thresholds and rates to generate topographies. [11][12][13][14]…”

Section: Laser Ablative Techniquementioning

confidence: 99%

Relating Chemical and Topographical Modification of Materials to Macroscopic Adhesion

Palmieri¹,

Wohl²,

Belcher³

et al. 2011

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Pre-bonding technology based on excimer laser surface treatment

Cited by 48 publications

References 10 publications

Selective Grafting of Polyamines to Polyether Ether Ketone Surface during Molding and Its Use for Chemical Plating

Selective Grafting of Polyamines to Polyether Ether Ketone Surface during Molding and Its Use for Chemical Plating

Laser ablation of polyetheretherketone films for reversible wafer bonding

Relating Chemical and Topographical Modification of Materials to Macroscopic Adhesion

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