Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC

Kim, Jihye; Hwang, In-Su; Kim, Youngwoo; Cho, Jonghyun; Tummala, Rao; Kim, Joungho

doi:10.1109/ectc.2015.7159601

Cited by 16 publications

(5 citation statements)

References 4 publications

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“…Some of the published papers [1], [8]- [10] observed the phenomena of TPVs in glass, while other papers [11]- [14] failed to identify this taper effect. The simulated relative transmission results and the simulated crosstalk with frequency were presented for TPVs with various taper angles drilled by different methods [8], [9], and the exit via diameters were examined for various taper angles in the case of a fixed top diameter of 50 μm [1].…”

mentioning

confidence: 75%

“…The parasitic ac resistance value can be calculated in a similar way, but due to the skin effect, the current tends to flow on the surface, which should be taken into consideration. It is worthy to mention that if the skin depth is larger than the via diameter, all the copper is still used to conduct current, which was ignored by the authors in [10] and [18]. So, the parasitic ac resistance value is expressed as…”

Section: B Computation Of Parasitic Rlcgmentioning

confidence: 99%

“…In this section, a wideband scalable electrical model is proposed for such tapered TPVs. The closed-form equations were developed for parasitic dc and ac resistances, which compensate for the inaccuracy in [10] and [18], while semianalytic equations were presented to evaluate the parasitic inductance, capacitance, and conductance. Since the circuit model is based on the fundamental electric and magnetic fields, it has validity across a wide bandwidth, as shown in Section III.…”

Section: Modeling Of Tapered Tpvsmentioning

confidence: 99%

“…However, the effect of the TPV taper on the electrical parameters was not extensively analyzed. A precise RLGC model was proposed in [10] to analyze the TPVs in 2.5-D/3-D glass interposers, but the model was based on the assumption of cylindrical vias, even though the authors mentioned the worthiness of modifying the model for tapered vias. Although the modeling of TPVs in glass has not been widely reported, there are a number of published reports on the modeling of TSVs [15]- [20].…”

mentioning

confidence: 99%

“…Meanwhile, different via shapes were simulated and compared in terms of S-parameters, but a quantitative analysis was not presented [17]. Closed-form formulas were developed and verified against the simulated values for the resistances and the inductances of tapered TSVs [18], but the formula for highfrequency resistance broke down when the skin depth was larger than the via diameter, which also happened in [10]. A numerical technique using conical modal basis functions was developed to compute the parasitic resistance, inductance, capacitance, and conductance RLCG of TSVs [19].…”

mentioning

confidence: 99%

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Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers

Tong

Sato

Panayappan

et al. 2016

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper proposes a wideband scalable circuit model for tapered through-package vias (TPVs) in glass interposers. By slicing TPVs horizontally into infinitesimally thin pieces and integrating along TPVs, an analytical solution was derived for the parasitic resistance (R), while semianalytical expressions were derived for the parasitic inductance (L), capacitance (C), and conductance (G) in the proposed model. Then, this model was verified against a 3-D electromagnetic solver in terms of S-parameters for various TPV dimensions, with the differences of S 21 magnitude and S 21 phases being less than 0.01 dB and 1°, respectively. In addition, two dual-via chains of different lengths were designed, fabricated, and measured to benchmark the proposed model up to 20 GHz. The excellent consistency between them further proves the validity of the proposed model. Finally, the effect of the TPV taper was comprehensively studied on the RLCG parameters. It was found that the TPV taper was beneficial to reduce the parasitic capacitance and conductance by as much as 40%. Despite these benefits, tapered TPVs are not preferred, because the parasitic resistance and inductance are the dominant factors for TPVs in glass, and the TPV taper increases the parasitic resistance drastically and also increases the parasitic inductance by as much as 80%.

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