2015
DOI: 10.1007/s10854-015-3871-9
|View full text |Cite
|
Sign up to set email alerts
|

Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2017
2017
2024
2024

Publication Types

Select...
3
2

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 20 publications
0
1
0
Order By: Relevance
“…can have an effect on the l c , which may promote dislocations from local pinning and thus affect the plastic behavior of materials [130]. Ma et al [131] deduced the creep model under the coupled action of force, electricity and heat:…”
Section: Electroplastic Effectmentioning
confidence: 99%
“…can have an effect on the l c , which may promote dislocations from local pinning and thus affect the plastic behavior of materials [130]. Ma et al [131] deduced the creep model under the coupled action of force, electricity and heat:…”
Section: Electroplastic Effectmentioning
confidence: 99%