Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices

Lee, Chang‐Chun; Wei, Pal Jen; Chian, Bow-Tsin; Tsai, Chia‐Hao; Dzeng, Yu-Hua

doi:10.1016/j.tsf.2015.01.020

Cited by 4 publications

(4 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The incremental crack length effect of adhesion strength on several low-k film system is examined by combining FEA simulation and 4PBT [Lee, Huang, Chang et al (2009)]. Lee et al [Lee, Wei, Chian et al (2015)] investigated the interfacial adhesion properties of encapsulated films in flexible displays. The presented results showed the feasibility of cracking advancing along the PSA/SiN interface or within the PSA film with the nearly cracking resistance.…”

Section: Peeling Stress and Stress Intensity Factor Prediction Enablementioning

confidence: 99%

Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications

Lee¹,

Huang²

2019

Computer Modeling in Engineering &Amp; Sciences

Self Cite

View full text Add to dashboard Cite

This research reviews the application of computational mechanics on the properties of nano/micro scaled thin films, in which the application of different computational methods is included. The concept and fundamental theories of concerned applications, material behavior estimations, interfacial delamination behavior, strain engineering, and multilevel modeling are thoroughly discussed. Moreover, an example of an interfacial adhesion estimation is presented to systematically estimate the related mechanical reliability issue in the microelectronic industry. The presented results show that the peeled mode fracture is the dominant delamination behavior of layered material system, with high stiffness along the bonding interface. However, the shear mode fracture being dominated as the polymer cover plate with low moduli is considered. The occurrence of crack advance is also significantly influenced by the interfacial crack length and applied loading. Therefore, this paper could serve as a guideline of several engineering cases with the assistance of computational mechanics.

show abstract

Section: Peeling Stress and Stress Intensity Factor Prediction Enablementioning

confidence: 99%

Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications

Lee¹,

Huang²

2019

Computer Modeling in Engineering &Amp; Sciences

Self Cite

View full text Add to dashboard Cite

show abstract

“…Pressure-sensitive adhesives (PSAs) are materials that adhere quickly under low pressures. − PSA products are widely applied in the packaging, automotive, electrical, and medical fields. − The pressure-sensitive-adhesive paper (PSAP) studied here is a PSA product. A PSAP is typically composed of three parts: (1) paper, which acts as a substrate; (2) PSA, coated on the paper; (3) release paper.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Release-Paper-Free, Pressure-Sensitive-Adhesive Paper Using an Interfacial Polymerization Reaction on the Paper Surface

Ichiura

Sakamoto

Ohtani

2016

Ind. Eng. Chem. Res.

View full text Add to dashboard Cite

An interfacial polymerization reaction was used to prepare a pressure-sensitive adhesive paper that did not require release paper (PSAP without ). Filter paper impregnated with an oil−water emulsion comprising ethylenediamine (EDA) and pressure-sensitive adhesive (PSA) was immersed in a solution of terephthaloyl chloride in cyclohexane, and the polyamide film containing the PSA attached itself to the treated paper surface. The pressure-sensitive-adhesive paper (PSAP) prepared by employing this interfacial polymerization did not require the use of release paper. In the case of the PSAP without samples prepared using 2.5%, 5%, and 10% EDA and 60 mL of a 35% PSA−cyclohexane solution, the peel strengths were 460, 493, and 438 mN, respectively. The PSAP without prepared under these conditions adhered sufficiently to the aluminum foil after a hot-press treatment. An EDA concentration of 5% and a 60 mL volume of the 35% PSA−cyclohexane solution maximized the adhesiveness of the PSAP without .

show abstract

“…g ., aligned single-walled carbon nanotubes (SWCNTs), conductive elastomers, and metal film) onto polymer surfaces. − Strain sensors with superior performance in detecting large deformations or high sensitivities have been obtained by designing special materials or structures in previously reported researches. , However, durability is still a severe bottleneck which restricts the practical applications of these sensors. The poor durability is attributed to, first, the low adhesion strength between the conductive layer and base and, second, the friction generated in solid conductive materials during the loading–unloading process, which is irreparable and will lead to increasing resistance and instability of the electrical signals. , …”

mentioning

confidence: 99%

“…The poor durability is attributed to, first, the low adhesion strength between the conductive layer and base and, second, the friction generated in solid conductive materials during the loading− unloading process, which is irreparable and will lead to increasing resistance and instability of the electrical signals. 17,18 Nature offers a delicate idea to solve the above-mentioned problems. The eye surface and eyelids rub about 10 000 times per day when we blink.…”

mentioning

confidence: 99%

Bioinspired Self-Healing Liquid Films for Ultradurable Electronics

et al. 2019

View full text Add to dashboard Cite

Resistive strain sensors play a crucial role in the development of flexible and stretchable electronics because of their excellent sensitivity and conformability. However, such sensors suffer from poor durability because of the low adhesion strength between the solid conductive layer and polymer and the irreparable dry friction inside the conventional solid conductive layers. Here, inspired from the structures and excellent abrasion resistance of tear films on animal corneas, we demonstrate ultradurable strain sensors based on uniform self-healing wear-free liquid films formed on biomimetic microvilli made from modified polydimethylsiloxane (PDMS). Ethanol solutions containing ionic liquids (ILs) are added to PDMS microvilli, which are superlyophilic due to the surface chemistry and special structures. During evaporation, ILs are driven upward by Laplace pressure and join into continuous conductive films. As the sensing layer, when repeatedly stretched and released, the capillary-stabilized liquid film is lossless because of wet friction, and the cracks will recover completely after release due to the capillary-force-induced self-healing capability, allowing the strain sensors to exhibit high durability of over 22 500 loading–unloading cycles. This work presents an approach for the construction of ultradurable electronics.

show abstract

Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices

Cited by 4 publications

References 24 publications

Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications

Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications

Preparation of Release-Paper-Free, Pressure-Sensitive-Adhesive Paper Using an Interfacial Polymerization Reaction on the Paper Surface

Bioinspired Self-Healing Liquid Films for Ultradurable Electronics

Contact Info

Product

Resources

About