The blistering phenomenon in OPIT-derived Bi(Pb)SCCO/Ag (Bi-2223/Ag) composite tapes has been studied for a wide range of tape processing parameters. A Pb-free and Bi-deficient phase was observed after prolonged sintering (for 50-100 h at 830-840 • C) at the internal surface of an cylindrical cavity formed inside a ceramic core during heating. It depressed the 2212-to-2223 transformation in the blistered sample and led to an extremely low value of J c of 500 A cm −2 at 77 K. At a given sample length a critical heating rate existed below which cylinders did not grow. This rate decreased with sample length increase. Preliminary rolling of a blistered tape just after cylinder formation as well as the annealing of as-rolled tape at 500-700 • C prevented blistering during the subsequent thermomechanical processing. These measures resulted in the value of J c exceeding 1 × 10 4 A cm −2 at 77 K.