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Superconducting technology applications in electric machines have long been pursued due to their significant advantages of higher efficiency and power density over conventional technology. However, in spite of many successful technology demonstrations, commercial adoption has been slow, presumably because the threshold for value versus cost and technology risk has not yet been crossed. One likely path for disruptive superconducting technology in commercial products could be in applications where its advantages become key enablers for systems which are not practical with conventional technology. To help systems engineers assess the viability of such future solutions, we present a technology roadmap for superconducting machines. The timeline considered was ten years to attain a Technology Readiness Level of 6+, with systems demonstrated in a relevant environment. Future projections, by definition, are based on the judgment of specialists, and can be subjective. Attempts have been made to obtain input from a broad set of organizations for an inclusive opinion. This document was generated

For high current superconductors in high magnet fields with currents in the order of 50 kA, single ReBCO coated conductors must be assembled in a cable. The geometry of such a cable is mostly such that combined torsion, axial and transverse loading states are anticipated in the tapes and tape joints. The resulting strain distribution, caused by different thermal contraction and electromagnetic forces, will affect the critical current of the tapes. Tape performance when subjected to torsion, tensile and transverse loading is the key to understanding limitations for the composite cable performance. The individual tape material components can be deformed, not only elastically but also plastically under these loads. A set of experimental setups, as well as a convenient and accurate method of stress-strain state modeling based on the finite element method have been developed. Systematic measurements on single ReBCO tapes are carried out combining axial tension and torsion as well as transverse loading. Then the behavior of a single tape subjected to the various applied loads is simulated in the model. This paper presents the results of experimental tests and detailed FE modeling of the 3D stress-strain state in a single ReBCO tape under different loads, taking into account the temperature dependence and the elastic-plastic properties of the tape materials, starting from the initial tape processing conditions during its manufacture up to magnet operating conditions. Furthermore a comparison of the simulations with experiments is presented with special attention for the critical force, the threshold where the tape performance becomes irreversibly degraded. We verified the influence of tape surface profile non-uniformity and copper stabilizer thickness on the critical force. The FE models appear to describe the tape experiments adequately and can thus be used as a solid basis for optimization of various cabling concepts.

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A controlled introduction of second-phase Y 2 BaCuO 5 (211) nanoparticles into YBa 2 Cu 3 O 7−␦ (123) thin films was achieved for the first time for the purpose of increasing flux pinning. The island-growth mode of 211 on 123 was utilized to obtain an area particle density >10 11 cm −2 of 211 thick-disk-shaped nanoparticles in individual layers. Composite layered structures of (211 y nanoparticles/123 z )×N were deposited by pulsed laser deposition on LaAlO 3 substrates, with N bilayers ‫ס‬ 24 to 100, y thickness ‫ס‬ 1 to 2 nm, and z thickness ‫ס‬ 6 to 15 nm (assuming continuous layer coverage). With 211 addition, the critical current densities at 77 K were higher at magnetic fields as low as 0.1 T and increased as much as approximately 300% at 1.5 T. The superconducting transition temperature was reduced by approximately 2 to 4 K for 211 volume fraction <20%. Reinitiation of 123 growth after every 211 layer resulted in a smooth and flat surface finish on the films and also greatly reduced surface particulate formation especially in thicker films (∼1 m).