ABSTRACT:Polyamides containing thymine photodimer units in the main chain were found to be applicable to a positive-chain scission type photoresist upon deep-UV exposure. Photo-dissociations of cyclobutane-type photodimers of thymine units caused the scission of the polymer chains, leading to decrease in molecular weight of the polymers. Photolithographic sensitivity and resolution test for these polymers indicated good sensitivity values with novel resolution of even 0.3 /lm. KEYWORDS Photodimerization / Thymine Photodimer /polyamide / Photodissociation /Deep UV Photoresist / Photoresist / Photosensitivity / High Resolution / Positive Type Photoresists / Positive photo resists are particularly attractive for VLSI device fabrication due to their high resolution. Most of the positive photoresists used for conventional photolithography are two-component dissolution inhibition resists. The best known conventional photoresist is based on the use of novolac (phenol formaldehyde) polymer with a diazonaphthoquinone photosensitive dissolution inhibitor, using light in the range of 350-450 nm.1,2 However, alternative inhibitors for these systems can afford bleachable chromophores for deep-UV light.3.4 The other positive type photoresists are chain scission polymers. Poly(methyl methacrylate) is a classic positive resist with high resolution upon deep-UV exposure. However, it has low sensitivity, which has been improved by copolymerization of methyl methacrylate with more absorb ant UV sensitive components. 6 Recently, we reported the successful synthesis of a new type of chain scission positive type photoresist based on polyamide containmg thymine photodimer units in the main 468 chain, and its photochemical reaction. In the synthesis of this polymer, thymine photodimer derivative prepared by photochemical reaction of the monomeric compound was reacted with 1 ,3-diamino propane in a condensation polymerization. The separated isomers of thymine photodimer applied in the synthesis of the polyamide did not cause considerable change in the polymer structure or its photochemical reaction. Lithographic resolution and sensitivity of these polymers upon deep-UV exposure are demonstrated in this article. Furthermore, we synthesized six types of polyamides containing thymine photodimer units with different diamines. We studied the effects of the diamine structures on the morphology of the polymers such as glass transition temperatures and melting points, which are important in the photodissociation of these polymers. Photolithographic evaluation of these polymers was also studied.