Waterborne lignin-based epoxy resin emulsions (WLEPs)
bearing poly(ethylene
glycols) (PEGs) as hydrophilic and soft segments were successfully
prepared without using any solvent, and then the WLEPs were cured
with polyamide (PA) and the soybean protein isolate (SPI) to form
wood adhesives SPI/WLEP/PA with good bonding performance and water
resistance. The WLEPs were uniformly dispersed in the SPI matrix,
and the multiple interactions between WLEP, PA, and SPI resulted in
a more stable and compact cross-linked network, which was conducive
to enhancing the cohesion strength, water tolerance, and thermal stabilities
of the SPI-based adhesives. In comparison to the pristine SPI adhesive,
the dry and hot water (63 °C for 3 h) shear strengths of the
plywood formulated with SPI/WLEP/PA (WLEP: 16 wt %) remarkably increased
by 137% (3.94 MPa) and 134% (0.75 MPa), respectively, satisfying the
demand of interior-use plywood type II. Especially, when the WLEP
loading reached 21 wt %, the plywood demonstrated outstanding boiling
water strength of 0.77 MPa, higher than the China national standard
requirement for exterior-grade plywood type I (≥0.70 MPa).
These results suggested that the WLEPs could serve as a green and
effective cross-linker to give SPI-based wood adhesives with high
water tolerance and bonding performance.