Preparation and characterization of electroplated amorphous gold–nickel alloy film for electrical contact applications

Togasaki, Norihiro; Okinaka, Y.; Homma, Takayuki; Osaka, Tetsuya

doi:10.1016/j.electacta.2005.04.057

Cited by 38 publications

(26 citation statements)

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“…This new phase can be attributed to the formation of a Au-Ni alloy. Indeed, this assertion is supported by the work of Togasaki et al [25] who attributed an XRD peak at 2h = 42°to amorphous Au-Ni alloy (8-51% mol Au) prepared by the addition of KAu(CN) 2 to a Ni-W plating bath. Metal particle size was evaluated by the standard Scherrer line broadening approach (Table 1) where the metal particle size was smaller in the alloy compared with the monometallic sample.…”

Section: Catalyst Characterizationmentioning

confidence: 69%

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Gas Phase Hydrogenation of m-Dinitrobenzene over Alumina Supported Au and Au–Ni Alloy

2008

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We report, for the first time, 100% selectivity in the continuous gas phase hydrogenation of m-dinitrobenzene to m-nitroaniline (m-NAN) over Au/Al 2 O 3 . The synthesis and application of an alumina supported Au-Ni alloy is also described where alloy formation is demonstrated by XRD, diffuse reflectance UV-Vis and HRTEM analyses. Under the same reaction conditions, Au/Al 2 O 3 delivered a higher (by close to an order of magnitude) hydrogenation rate compared with the alloy. Au-Ni/Al 2 O 3 promoted the formation of both m-NAN and m-phenylenediamine, i.e. partial and complete hydrogenation: the results are consistent with a stepwise reduction mechanism.

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Section: Catalyst Characterizationmentioning

confidence: 69%

“…c-Al 2 O 3 (10-0425), Au (4-0784) and Ni (45-1027), and Ref. [25] for the Au-Ni alloy. Metal particle size (d hkl ) was estimated using the Scherrer equation:…”

Section: Catalyst Characterizationmentioning

confidence: 99%

Gas Phase Hydrogenation of m-Dinitrobenzene over Alumina Supported Au and Au–Ni Alloy

2008

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“…Three different topics were covered. The first topic was concerned with a new non-cyanide, electrolytic soft-gold plating bath containing both thiosulfate and sulfite as [8]. Table 6 Comparison between cobalt-hardened gold (CoHG) and amorphous Au-Ni alloy for bulk resistivity and contact resistance [8] CoHG Amorphous Au-Ni ligands for Au(I).…”

Section: Discussionmentioning

confidence: 99%

“…The first topic was concerned with a new non-cyanide, electrolytic soft-gold plating bath containing both thiosulfate and sulfite as [8]. Table 6 Comparison between cobalt-hardened gold (CoHG) and amorphous Au-Ni alloy for bulk resistivity and contact resistance [8] CoHG Amorphous Au-Ni ligands for Au(I). This bath is recommended in place of the commonly available sulfite bath because of the advantage of the greater stability without the necessity of adding a stabilizer.…”

Section: Discussionmentioning

confidence: 99%

“…Thus, to be prepared for the future need of an amorphous electrical contact material, we made a preliminary investigation on the possibility of electroplating amorphous Au-Ni alloy from a bath prepared by adding a gold salt into a bath that is already known to deposit an amorphous alloy such as Ni-W [7]. This approach was successful in developing a process to electroplate amorphous Au-Ni alloy with a hardness value greater than twice that of the conventional hard gold without adversely affecting the electrical contact resistance [8,9]. Using a similar approach, we also developed a process for electroplating amorphous Au-Co alloy films [9].…”

Section: Introductionmentioning

confidence: 99%

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Development of new electrolytic and electroless gold plating processes for electronics applications

Osaka

Okinaka

Sasano

et al. 2006

Science and Technology of Advanced Materials

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This article reviews results of our investigations, performed over the period of a decade, on gold plating for electronics applications. Three different topics are covered: (1) development of a new, non-cyanide, soft-gold electroplating bath containing both thiosulfate and sulfite as ligands; (2) evaluation of a known cyanide-based, substrate-catalyzed electroless bath for depositing pure soft gold, and subsequent development of an alternative, non-cyanide, substrate-catalyzed bath; and (3) development of a new process to electroplate amorphous hard-gold alloys for probable future applications as a contact material on nano-scale electronic devices. r

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Metal-Based Electrical Contact Materials

Varol,

Güler

2023

Advances in Material Research and Technology

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Preparation and characterization of electroplated amorphous gold–nickel alloy film for electrical contact applications

Cited by 38 publications

References 3 publications

Gas Phase Hydrogenation of m-Dinitrobenzene over Alumina Supported Au and Au–Ni Alloy

Gas Phase Hydrogenation of m-Dinitrobenzene over Alumina Supported Au and Au–Ni Alloy

Development of new electrolytic and electroless gold plating processes for electronics applications

Metal-Based Electrical Contact Materials

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