“…These properties render Mo-Cu alloys widespread applications in electronic packing devices [7], heat sink materials [8], vacuum technology [6], aeronautics [5] and so on. In most of the applications, high-dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process [9], metal injection molding [10], electroless plating technique [11], mechanical alloying process [12] and gelatification-reduction process [6]. However, most of these methods were accomplished at high temperature (typically 900 • C), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure.…”