2009
DOI: 10.1016/j.jallcom.2008.09.097
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Preparation and characterization of Mo-15 Cu superfine powders by a gelatification-reduction process

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Cited by 41 publications
(13 citation statements)
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“…In most of the applications, high-dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process [9], electroless plating technique [10], mechanical alloying process [11], and gelatification-reduction process [12]. However, most of these methods were accomplished at high temperature (typically 900 • C), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure.…”
Section: Introductionmentioning
confidence: 99%
“…In most of the applications, high-dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process [9], electroless plating technique [10], mechanical alloying process [11], and gelatification-reduction process [12]. However, most of these methods were accomplished at high temperature (typically 900 • C), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure.…”
Section: Introductionmentioning
confidence: 99%
“…Compared with their partners (e.g. W-Cu alloys), Mo-Cu alloys are easier to sinter and process due to the small density difference between Mo and Cu and low melting point of Mo [6]. These properties render Mo-Cu alloys widespread applications in electronic packing devices [7], heat sink materials [8], vacuum technology [6], aeronautics [5] and so on.…”
Section: Introductionmentioning
confidence: 99%
“…W-Cu alloys), Mo-Cu alloys are easier to sinter and process due to the small density difference between Mo and Cu and low melting point of Mo [6]. These properties render Mo-Cu alloys widespread applications in electronic packing devices [7], heat sink materials [8], vacuum technology [6], aeronautics [5] and so on. In most of the applications, high-dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process [9], metal injection molding [10], electroless plating technique [11], mechanical alloying process [12] and gelatification-reduction process [6].…”
Section: Introductionmentioning
confidence: 99%
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“…O molibdênio é um metal refratário de interesse para aplicações que envolvam altas temperaturas, por possuir alto ponto de fusão (2623ºC), no entanto, isto torna extremamente difícil seu processamento por fundição (Song et al, 2008). Devido à baixa sinterabilidade de sistemas com metais refratários, a utilização de pós ultrafinos e homogêneos podem melhorar a sinterabilidade deste material, especialmente na sinterização em fase líquida de sistemas como o Mo-Cu em que o mecanismo dominante na sinterização é o rearranjo das partículas (Martinez et al, 2007).…”
Section: Introductionunclassified