Preparation and properties of novel oligo(phenylene oxide)-branched cyclophosphazenes

Tada, Yasuhiro; Moriya, Narimasa; Kanazawa, Makoto; Asanuma, Kota; Suzuki, Atsuko; Koyama, Shigeto

doi:10.1039/c2py20433a

Cited by 10 publications

(5 citation statements)

References 17 publications

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“…Given the high thermostability of PPO reported previously, 1–3 thermo-gravimetric analysis was also carried out. In the TG curves, the T d5% values of the PPO obtained under different experimental conditions are independent of the molecular weights and are in the range of 427 °C–439 °C (Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Poly(2,6-dimethyl-1,4-phenylene oxide) (PPO) is one of the most important engineering plastics, and has been extensively used for electrical and electronic equipment, vehicle parts, business machines and high-frequency applications given its satisfactory properties such as thermal stability, flame retardation, dimensional stability and low moisture absorption. [1][2][3] In general, PPO is synthesized via the reaction between 2,6-dimethylphenol (DMP) monomer and O 2 in toluene or benzene in the presence of Cu(I)-amine complexes. [4][5][6] The molecular weights of the obtained PPO are always higher than 30 000 with a glass transition temperature (T g ) of approximately 210 °C, 1,4 indicating the poor processability and high melt viscosity of the high-molecular-weight PPO (HMW-PPO).…”

Section: Introductionmentioning

confidence: 99%

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Chemical and physical properties of low-molecular-weight poly(2,6-dimethyl-1,4-phenylene oxide) (LMW-PPO) synthesized by peroxydisulfate and metal/non-metal catalysts

Liu

et al. 2023

Polym. Chem.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Chemical and physical properties of low-molecular-weight poly(2,6-dimethyl-1,4-phenylene oxide) (LMW-PPO) synthesized by peroxydisulfate and metal/non-metal catalysts

Liu

et al. 2023

Polym. Chem.

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“…To alleviate the shortcomings of PPO, oligo(2,6-dimethyl-1,4-phenylene ether) also known as OPE was established. − ,,− To compensate for the loss in thermal and mechanical properties owing to the low molecular weight of OPE, it should be cured with epoxy resins by terminal hydroxyl . However, secondary hydroxyl groups with high polarity would be generated by the ring-opening reaction of epoxide, sacrificing the dielectric characteristic.…”

Section: Introductionmentioning

confidence: 99%

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

et al. 2022

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In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor ( D f ), and square root of dielectric constant ( D k ). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D k and D f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm –3 ), a lower coefficient of thermal expansion (55 vs 76 ppm/°C), better dielectric characteristic at 10 GHz ( D k values of 2.58 vs 2.75, D f values of 0.005 vs 0.006), lower water absorption (0.135 vs 0.312 wt %), and better flame retardancy (UL-94 VTM-0 vs VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.

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“…Poly(2,6-dimethyl phenylene oxide) (PPO), with hydrophobic dimethyl and low polar phenylene oxide structure, possesses a low dielectric constant of 2.5. Oligo PPOs with allyl, methyl methacrylate, and styrene curable linkage have been widely used for printed circuit boards. − Taking advantage of the low dielectric characteristic of PPO, Ueda et al prepared fluorinated polyimides containing phenylene oxide and a perfluorobiphenyl structure . They concluded that the incorporation of the perfluorobiphenyl unit accompanied with a phenylene ether unit effectively decreases the dielectric constant while maintaining the thermal stability of polyimides.…”

Section: Introductionmentioning

confidence: 99%

Low Dielectric Polyetherimides Derived from Bis[4-(4-(4-aminophenoxy)-2-tert-butylphenoxy)phenyl] Sulfone and 4,4′-Bis[4-(4-aminophenoxy)-2-tert-butylphenoxy]perfluorobiphenyl

et al. 2017

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Two diamines, bis[4-(4-(4-aminophenoxy)-2- tert -butylphenoxy)phenyl] sulfone (PSNH 2 ) and 4,4′-bis[4-(4-aminophenoxy)-2- tert -butylphenoxy)perfluorobiphenyl (PFNH 2 ), were prepared from 3- tert -butyl-4-hydroxyanisole using a four-step procedure, including two nucleophilic substitutions, demethylation, and catalytic reduction. On the basis of PSNH 2 and PFNH 2 , two series of low dielectric polyetherimides (PEIs) were prepared. Both series of PEIs exhibit moderate-to-high thermal properties, including a glass transition temperature ( T g ) > 259 °C (depending on the rigidity of dianhydride), a 5 wt % decomposition temperature ( T d5% ) > 496 °C, and a coefficient of thermal expansion < 66 ppm/°C. Because of the hydrophobic tert -butyl phenylene oxide structure, both series of PEIs show excellent dielectric properties, with a dielectric constant as low as 2.4–2.7. The structure–property relationship of both series of PEIs is discussed in this work.

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Preparation and properties of novel oligo(phenylene oxide)-branched cyclophosphazenes

Cited by 10 publications

References 17 publications

Chemical and physical properties of low-molecular-weight poly(2,6-dimethyl-1,4-phenylene oxide) (LMW-PPO) synthesized by peroxydisulfate and metal/non-metal catalysts

Chemical and physical properties of low-molecular-weight poly(2,6-dimethyl-1,4-phenylene oxide) (LMW-PPO) synthesized by peroxydisulfate and metal/non-metal catalysts

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

Low Dielectric Polyetherimides Derived from Bis[4-(4-(4-aminophenoxy)-2-tert-butylphenoxy)phenyl] Sulfone and 4,4′-Bis[4-(4-aminophenoxy)-2-tert-butylphenoxy]perfluorobiphenyl

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