Preparation and properties of Si3N4/PS composites used for electronic packaging

He, Hong; Fu, Renli; Shen, Yuan; Yan, Han; Song, Xiufeng

doi:10.1016/j.compscitech.2006.12.014

Cited by 131 publications

(74 citation statements)

References 22 publications

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“…In many literatures, it has been confirmed that the interface in the composites play a significant role in their thermal conductivity [236][237][238][239][240][241]. Heat transfer at the interface of two different materials mostly happens with a temperature discontinuity [242].…”

Section: Thermal Conductivitymentioning

confidence: 99%

“…This phenomenon was explained by increasing the transmission coefficient of the phonons [263,278]. Modification of the end groups of the polymer chains [261] and surface modification of the fillers (either with [237,[280][281][282][283][284] or applying specific coatings [285][286][287]) are common methods for improving the adhesion at the interfaces with subsequent thermal conductivity enhancement. However, it should be considered that the functionalization of the filler may create defects and decrease the intrinsic thermal conductivity of them [288].…”

Section: Thermal Conductivitymentioning

confidence: 99%

See 1 more Smart Citation

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

172

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Composite materials and especially polymer composites are widely used in daily life and different industries due to their vastly different properties and design flexibility. It is known that the properties of the composites are strongly related to the properties of its constituents. However, it has been reported in many studies, experimentally and by simulations, that the characteristics of the composites do not follow the rule of mixing. It means that in addition to properties of the constituents, there are other parameters affecting the final physicochemical properties of composites. The interfacial interactions between fillers and host is one of the factors which can strongly affect the properties of the composite. In this review, we summarized the type of interactions between the constituents, their improvement techniques, interaction measurement methods, and the effects of interfacial interactions on thermal, mechanical, and electrical properties of composites.

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Section: Thermal Conductivitymentioning

confidence: 99%

Section: Thermal Conductivitymentioning

confidence: 99%

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

172

View full text Add to dashboard Cite

show abstract

“…16) However, there have been smaller number of report on the application of Si 3 N 4 as a filler material for ceramic/resin composites compared with other ceramics filler. 17) Furthermore, it has not known how the silicon nitride types with different thermal conductivity affect to thermal conductivity of composite material. In this investigation, we examined the effects of the types of Si 3 N 4 and the loading amounts of Si 3 N 4 on the thermal conductivities of resulting composites with epoxy resin.…”

Section: )mentioning

confidence: 99%

Effect of amounts and types of silicon nitride on thermal conductivity of Si<sub>3</sub>N<sub>4</sub>/epoxy resin composite

Shimamura

Hotta

Hyuga

et al. 2015

J. Ceram. Soc. Japan

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Thermal conductive ceramic/resin composites are necessary for thermal management in order to improve the reliability of highperformance products in various industrial fields. The present study created composites consisting of silicon nitride (Si 3 N 4 ) particles and epoxy resin by imbedding the particles into the resin matrix. Two common types of Si 3 N 4 were applied in this work. ¡ phase (¡-Si 3 N 4 ) and ¢ phase (¢-Si 3 N 4 ) silicon nitride were loaded with epoxy resin. The effect of Si 3 N 4 type on the thermal conductivity of composites was investigated by varying the Si 3 N 4 particle content. For composites below 50 vol.% Si 3 N 4 , there was almost no difference in thermal conductivity between equivalently loaded ¡-Si 3 N 4 or ¢-Si 3 N 4 /epoxy composites. However, for Si 3 N 4 contents exceeding 50 vol.%, the ¢-Si 3 N 4 /epoxy composites showed higher thermal conductivities relative to the ¡-Si 3 N 4 / epoxy composite. The relative difference in thermal conductivities between the ¢-Si 3 N 4 and ¡-Si 3 N 4 epoxy composites (¢-Si 3 N 4 / ¡-Si 3 N 4 ) increased to 1.6 times at 68 vol.% of Si 3 N 4 content.

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“…High crystallization and orientation of polymer can greatly enhance the thermal conductivity along the orientation direction, but they usually have difficulties of processing [5]. Blending of polymer with inorganic fillers is an effective and convenient way to enhance the polymer thermal conductivity while maintaining the electrical insulation, such as polymer composites with boron nitride (BN) [6,7], aluminum nitride (AlN) [2,3], silicon nitride (Si 3 N 4 ) [8,9], alumina [10], silicon carbride (SiC) [11] and silica (SiO 2 ) etc. [12] have been investigated.…”

Section: Introductionmentioning

confidence: 99%

The effects of particle size and content on the thermal conductivity and mechanical properties of Al2O3/high density polyethylene (HDPE) composites

Zhang¹,

Cao²,

M.³

et al. 2011

Express Polym. Lett.

179

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Abstract. The influences of filler size and content on the properties (thermal conductivity, impact strength and tensile strength) of Al 2 O 3 /high density polyethylene (HDPE) composites are studied. Thermal conductivity and tensile strength of the composites increase with the decrease of particle size. The dependence of impact strength on the particle size is more complicated. The SEM micrographs of the fracture surface show that Al 2 O 3 with small particle size is generally more efficient for the enhancement of the impact strength, while the 100 nm particles prone to aggregation due to their high surface energy deteriorate the impact strength. Composite filled with Al 2 O 3 of 0.5 µm at content of 25 vol% show the best synthetic properties. It is suggested that the addition of nano-Al 2 O 3 to HDPE would lead to good performance once suitably dispersed.

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Preparation and properties of Si3N4/PS composites used for electronic packaging

Cited by 131 publications

References 22 publications

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Effect of amounts and types of silicon nitride on thermal conductivity of Si<sub>3</sub>N<sub>4</sub>/epoxy resin composite

The effects of particle size and content on the thermal conductivity and mechanical properties of Al2O3/high density polyethylene (HDPE) composites

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