Preparation of a novel ternary photosensitive polyimide for liquid crystal alignment films

Xu, Yuanhao; Zhu, Gang; Wang, Yinghan

doi:10.1080/02678292.2021.1936233

Cited by 8 publications

(5 citation statements)

References 40 publications

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“…It is obvious to see that the reported PSPIs mostly focused on the development of photosensitive reagents and their combination with conventional thermally stable PI to formulate PSPI, but few studies have discussed the impact of chain rigid and film transparency on the performance of PSPI. For example, Zhu et al reported a series of studies on the structural design for PSPI‐based liquid crystal alignment films 25–28 . Fan et al presented the application of poly(amic ester) in PSPI 29 .…”

Section: Introductionmentioning

confidence: 99%

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Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Chang

Tseng

et al. 2023

Journal of Polymer Science

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Photosensitive polyimides (PSPIs) have been widely used in the buffer coating layer and insulation layer due to their excellent thermal and mechanical stability. In this work, a series of negative‐type PSPIs based on poly(amic acid) (PAA) and a photobase generator (PBG) have been developed. Two diamines of 4,4′‐oxydianiline (ODA), 3,3′‐diaminodiphenyl sulfone (SDA), and four dianhydrides of pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and cyclobutene‐1,2,3,4‐tetracarboxylic dianhydride (CBDA) are copolymerized to PAA through polyaddition, and the PAA is further thermally imidized to polyimide (PI). Through scrutinizing the structure–sensitivity relationship of these PIs, we find that the rigidity and transparency of the PAA/PI backbone play an important role in the sensitivity and contrast of PSPI. Accordingly, PSPI (SDA‐ODPA), possessing high optical transparency and a low rigidity represented by the low glass transition point, is capable of providing good photosensitivity of 30 mJ/cm2, a high contrast of 2.46, and an excellent pattern resolution of 4 μm after optimizing the prebaking (100°C for 5 min), exposure dose (380 mJ/cm2), post‐exposure baking (130°C for 7 min), and development parameters. This work provides the concept of structural design for negative‐type PSPI in the microelectronic application.

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Section: Introductionmentioning

confidence: 99%

“…For example, Zhu et al reported a series of studies on the structural design for PSPI-based liquid crystal alignment films. [25][26][27][28] Fan et al presented the application of poly(amic ester) in PSPI. 29 Song et al developed an intrinsic PSPI with the o-nitrobenzyl ether group.…”

Section: Introductionmentioning

confidence: 99%

Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Chang

Tseng

et al. 2023

Journal of Polymer Science

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“…Gao 12 reported an intrinsically negative photoresist with high optical transparency and high-temperature dimensional stability based on a poly (acid amid) (PAA) copolymer. A ternary photosensitive polyimide was synthesized by Xu 23 for liquid crystal display (LCD) based on BTDA, 6FDA and 2,2-bis (3-amino-4-hydroxyphenyl) propane (BAP). In all these studies, copolymerized PSPIs were polymerized by dissolving the diamine monomers in solution and then adding the dianhydride monomers.…”

Section: Introductionmentioning

confidence: 99%

Quaternary copolymerized polyimides and negative photosensitive polyimides: preparation and properties

Wu,

Zhang,

Cai

et al. 2023

High Performance Polymers

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Photosensitive polyimide (PSPI) have been developed base on polyimide (PI). PSPI can be used as insulating and protective materials in the microelectronics industry due to the excellent insulating properties, thermal stability, and chemical stability. In this work, we designed a synthetic method to improve the regularity of the polymer chain segment sequence. Quaternary block copolymerized precursors were prepared using condensation polymerization of poly (acid amid). A photosensitive poly (acid amid) salts (co-PAS) was also synthesized to produce patterns with photochemical reaction. After imidization, the resolution of copolymerized PSPI (co-PSPI) pattern was in the range of 16 μm–110 μm. Partial photoreactive cross-linking structure was maintained to improve the thermal stability of co-PSPI. The co-PSPI exhibited higher glass transition temperatures (327.0°C–358.8°C) than copolymerized PI (307.4°C–332.9°C). This work provides the study on the synthesis and properties of quaternary copolymerized PI and PSPI.

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“…With the rapid development of microelectronic industry, electronic components tend to be miniaturized and chip interconnection density has also increased sharply [1][2][3]. Fan-out wafer-level packaging (FOWLP) has been one of the latest packaging forms with the ultrathin redistribution layer (RDL) and higher I/O density [4,5].Thereinto, polyimide (PI) has become one of the most important dielectronic materials in RDL with superior thermal, mechanical property, low dielectronic constant and high chemical resistance and adhesion on various substrates [6-8]. However, new requirements have been appeared with the up-coming applications of 5G, AI, automate drive, internet of thing.…”

Section: Introductionmentioning

confidence: 99%

In-situ polymerization of low-dielectric fluorinated nano carbon/polyimide composites with low-temperature curable property

Zhang

Sui

et al. 2022

Preprint

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One challenge in advanced dielectric material of polyimides (PIs) is to obtain the excellent mechanical, thermal, and dielectric properties at low imidization temperature for fan-out wafer level package in 5G high-frequency communication. In this work, 6-aminoquinoline (AQL) is introduced through covalent bonds to obtain a low-temperature curable PI at first. The results demonstrate that with few addition (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200 oC. Then, fluorinated nano carbon (FC) is further introduced by in situ polymerization resulting in the fluorinated nano carbon/polyimide (FCPI) composites, which effectively reduces the dielectric constant (1wt%, 2.75 @ 1MHz). Besides, the as-prepared FCPIs also possess excellent thermal property, especially when the addition amount is 0.3wt%, the 5% weight loss temperature could be as high as 540 oC and the glass transition temperature is 385 oC. Furthermore, the tensile strength of the film is 127 MPa, the elongation at break is around 15.82%, and the Youngs’ modulus is about 3.10 GPa. So, the successful preparation of the FCPI nanocomposites not only possess low-temperature curing and low-dielectric performance but also exhibit excellent thermal and mechanical properties, which shows a wide range of application prospects in the field of microelectronics for the advanced electronic package.

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Preparation of a novel ternary photosensitive polyimide for liquid crystal alignment films

Cited by 8 publications

References 40 publications

Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Quaternary copolymerized polyimides and negative photosensitive polyimides: preparation and properties

In-situ polymerization of low-dielectric fluorinated nano carbon/polyimide composites with low-temperature curable property

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