The high cost of
substrates for III–V growth can be cost
limiting for technologies that require large semiconductor areas.
Thus, being able to separate device layers and reuse the original
substrate is highly desirable, but existing techniques to lift a film
from a substrate have substantial drawbacks. This work discusses some
of the complexities with the growth of a water-soluble, alkali halide
salt thin film between a III–V substrate and overlayer. Much
of the difficulty stems from the growth of GaAs on an actively decomposing
NaCl surface at elevated temperatures. Interestingly, the presence
of an
in situ
electron beam incident on the NaCl
surface, prior to and during GaAs deposition, affects the crystallinity
and morphology of the III–V overlayer. Here, we investigate
a wide range of growth temperatures and the timing of the impinging
flux of both elemental sources and high energy electrons at different
points during the growth. We show that an assortment of morphologies
(discrete islands, porous material, and fully dense layers with sharp
interfaces) and crystallinity (amorphous, crystalline, and highly
textured) occur depending on the specific growth conditions, driven
largely by changes in GaAs nucleation which is greatly affected by
the presence of the reflection high energy electron diffraction beam.