Preparation of epoxy-based insulator and optimization of its thermal property by Taguchi robust design method in double base propellant grain application

Babaee, Saeed; Monjezi, Zahra; Tagharoodi, Milad Saadat

doi:10.1007/s13726-017-0513-5

Cited by 6 publications

(4 citation statements)

References 27 publications

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“…However, due to the low thermal conductivity of EP, the thermal problems induced by the highdegree miniaturization and integration of electronic components in modern electronic products are becoming more and more prominent. At present, incorporating high thermal conductivity filler has been regarded as an effective way to improve the thermal conductivity of epoxy [20][21] . An important factor for the realization of nanocomposites with high thermal conductivity is the construction of three-dimensional thermal conductivity pathways in the matrix, which usually requires a high content of filler.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of carbon‐based epoxy nanocomposites: Dynamic mechanical, dielectric, and thermal properties

et al. 2020

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New types of carbon nanomaterials, such as multiwalled carbon nanotube (MWCNT) and graphene nanoplatelet (GNP), have attracted much attention in enhancing the thermal conductivity of polymers. However, due to the high electric conductivity of carbon materials, it is difficult for carbon-based epoxy to achieve the high thermal conductivity while obtaining desired dielectric property. In this article, using GNP and MWCNT modified by titanate coupling agent (PN-105), a novel method for highly thermally conductive, but electrically insulating epoxy nanocomposites is reported. The experimental results show that the 4% modified MWCNTs/epoxy nanocomposite has presented a simple thermal conductivity network, which can significantly improve the thermal conductivity of epoxy resin (EP), about 6.5 times higher than pure epoxy. Co-filled with 2% GNPs and 4% MWCNTs, the thermal conductivity of the epoxy nanocomposite is increased to 2.04 W/mK, 957% higher than pure epoxy. In addition, the dielectric constant of the composite is 9.1, which is maintained within an acceptable range. The dynamic mechanical results show that the filling of carbon materials can reduce the storage modulus and the loss factor of EP.

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Section: Introductionmentioning

confidence: 99%

Preparation and properties of carbon‐based epoxy nanocomposites: Dynamic mechanical, dielectric, and thermal properties

et al. 2020

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“…Heat accretion on polymeric insulating materials used in electric generators, potential transformers, high power switch units, and large-scale integrated circuits causes serious threats to system security and energy efficiency. − Thermal meta-materials have shown great potential in manipulating, controlling, and processing heat flow and make it possible to operate these electric instruments at high power density . However, thermal meta-materials can be used to manipulate the heat flow to the critical components, but the heat dissipation in the heat source region has been yielded.…”

Section: Introductionmentioning

confidence: 99%

Deterministic Manipulation of Heat Flow via Three-Dimensional-Printed Thermal Meta-Materials for Multiple Protection of Critical Components

Yang

Zhang

Sha

et al. 2022

ACS Appl. Mater. Interfaces

101

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Heat dissipation is necessary for the safer operation of high-power electronic devices and high-capacity batteries. Thermal meta-materials can efficiently manipulate heat flow by molding natural materials into specific structures. In this study, we construct a three-dimensional-printed meta-material structure with efficient and deterministic heat conduction through combining the 2D boron nitride (BN) with nano-diamond (DM) bridging. A research of thermal conductivity and dielectric properties exhibits that the nanosized diamond-bridged and oriented 2D boron nitride endows efficient heat transfer and maintains low dielectric loss with low filler loading. The composites loaded with 19 wt% BN platelets and 1 wt% DM have the highest thermal conductivity of 3.687 W/(m·K) in the heat flow orientation, while the thermal conductivity is only 0.632 W/(m·K) in the vertical heading of heat flow. The thermal conductive networks with thermal meta-materials based on the structural characteristics have been designed to secure critical device components from the heat source and dissipate heat flow in a definite way. The infrared images show that the temperature difference of monitoring points in different directions on the BN-oriented composite substrate is 9 °C, which realizes the protection of the heat source and key components. This study shows the latent capacity of 3D-printed structured materials for critical device component protection and heat administration applications in electronic devices and electric equipment.

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“…One of the many techniques for optimization of the key factors is the Taguchi method [20]. It can identify and organize system interactions within experimental data for the analysis leading to an optimal design [21,22]. Moreover, it is proven that this method can be applied to solve a variety of problems including continuous, discrete and qualitative design variables [23,24] Taguchi method classifies the analyzed factors as controllable and noise factors.…”

Section: Introductionmentioning

confidence: 99%

Preparation of insensitive composites based on penta erythritol tetra nitrate particles coated with carbon black- Triton X114 by a solvent/non-solvent process via Taguchi design optimization

Babaee

Pourmortazavi

Lemraski

2019

Hem Ind

Self Cite

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One way to reduce sensitivity and also to add special properties to explosives is to perform coating that depends on either the coating agent type or the usage process. In this work, the insensitive composite of penta erythritol tetra nitrate (PETN) was prepared with carbon black (CB) and Triton X-114 (TX114) by a solvent/non-solvent method. Taguchi experimental design (orthogonal array, L9) with using the impact sensitivity (H50) as a response was applied for the process optimization. Effects of the CB mass fraction, solvent flowrate, surfactant type and surfactant concentration were evaluated and the results were quantified by the analysis of variance (ANOVA). The ANOVA analysis predicted that the best H50 was 67.4 ± 1.5 cm for the optimum synthesis conditions of 5.0 wt% CB, 1 mL min-1 flowrate, and TX114 as a surfactant at a concentration of 2.010-3 mol L-1. The experimentally determined value of H50 was 68.0 ± 0.5 cm, which is in good agreement with the predicted value. Finally, thermal analysis and vacuum stability test were applied to the synthesized composite indicating that CB and TX114 are thermally adaptable and chemically compatible with PETN.

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Preparation of epoxy-based insulator and optimization of its thermal property by Taguchi robust design method in double base propellant grain application

Cited by 6 publications

References 27 publications

Preparation and properties of carbon‐based epoxy nanocomposites: Dynamic mechanical, dielectric, and thermal properties

Preparation and properties of carbon‐based epoxy nanocomposites: Dynamic mechanical, dielectric, and thermal properties

Deterministic Manipulation of Heat Flow via Three-Dimensional-Printed Thermal Meta-Materials for Multiple Protection of Critical Components

Preparation of insensitive composites based on penta erythritol tetra nitrate particles coated with carbon black- Triton X114 by a solvent/non-solvent process via Taguchi design optimization

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