Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte

Zhan, Xiaofei; Lian, Jiarong; Li, Hongjun; WANG, Xiu-bin; Zhou, Junzhi; Trieu, Khuong; Zhang, Xin-Ping

doi:10.1016/j.electacta.2020.137391

Cited by 50 publications

(29 citation statements)

References 51 publications

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“…Generally, grain size increases with increasing electroplated foil thickness and Cu 2+ concentration. Over potential ( η ) would increase as the copper ion concentration reduces [ 28 , 29 ]. The larger the over potential ( η ), the easier it is to obtain fine grains.…”

Section: Resultsmentioning

confidence: 99%

“…Note that a critical over potential ( η ) can form the field-oriented texture (FT) type with a high degree of twinning perpendicular to the (111) growth direction. Over potential ( η ) would increase as the Cu ion concentration reduces [ 28 , 29 ]. The low Cu ion concentration results in unoriented dispersion (UD) because the over potential ( η ) is above a critical value, which causes less preferred orientation (111) compared to that with a higher counterpart.…”

Section: Resultsmentioning

confidence: 99%

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Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating

2021

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Rotary electroplating was employed to fabricate high-strength nanotwinned copper (nt-Cu) foils serving as a current collector for high energy-density lithium ion batteries (LIBs). The effect of Cu ion concentration on the microstructural and mechanical properties of the nt-Cu foils was then investigated. Formation of nano-scaled grains was found at the bottom. Its size gradually increases toward the top surface to form a microstructural mixture of gradient nano-scaled and columnar grains in the upper region. Experimental results show that the grains and elongation of the nt-Cu foils increase with increasing concentration of Cu ions. However, a trade-off between tensile strength and elongation is present. The elongation of nt-Cu foils has been enhanced by 22% (from 3.1% to 3.8%) while 8.3% and 3.9% reductions in ultimate tensile strength (UTS) and yield stress (YS) are seen. The current study shows a promising method to tune and optimize the microstructure and mechanical properties of such nt-Cu foils for various applications.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating

2021

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“…Zhan et.al. [32] reported that the pulse frequency and pulse off time contribute to the growth of twin crystals. The spiral feature of the hexagonal pyramid on top of the nt-Cu indicated that the formation of periodic twin structures is owing to the screw dislocation-induced growth.…”

Section: Copper Texturementioning

confidence: 99%

“…The ultimate crystal planes were determined by the different growth trends. For example, Zhan et al [32] prepare high portion (111) textured nano-twinned copper in additive-free electrolytes via the PPR plating technology. The pulse frequency is medium-frequency (10~100 Hz).…”

Section: Copper Texturementioning

confidence: 99%

“…In high magnification SEM, planar morphology was a hexagonal pyramid with a clear step-and-terrace structure. The hexagonal pyramid structure at the surface of (111) copper is owing to screw dislocation growth [32]. When the reverse pulses increase to 1000 and 1500 Hz, the planar morphology of the copper is the accumulation of copper crystals with a longer hexagonal pyramid structure, with larger particles.…”

Section: Copper Texturementioning

confidence: 99%

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Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Li³

et al. 2022

Coatings

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The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.

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A new feature extraction technique based on improved owl search algorithm: a case study in copper electrorefining plant

Mansouri

Khayati

Zade

et al. 2022

Neural Comput & Applic

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Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte

Cited by 50 publications

References 51 publications

Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating

Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

A new feature extraction technique based on improved owl search algorithm: a case study in copper electrorefining plant

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