2020
DOI: 10.1021/acssuschemeng.0c03875
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Preparation of Low-Boron Silicon from Diamond Wire Sawing Waste by Pressure-Less Sintering and CaO–SiO2 Slag Treatment

Abstract: In order to recover silicon from diamond wire sawing waste, silicon extraction and boron removal are two key issues that need to be addressed. In this study, a combined process of pressure-less sintering and CaO−SiO 2 slag treatment was proposed. Low -boron silicon was prepared and considered as raw materials in solar cell production. The results confirmed that pressure-less sintering was beneficial for the digestion of the silicon oxide layer, and the molar percentage of oxygen in silicon kerf was reduced fro… Show more

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Cited by 22 publications
(5 citation statements)
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“…(5) The influence of heat transfer of flow was ignored. (6) The interface between molten slag and crucible was set to be no slip wall.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…(5) The influence of heat transfer of flow was ignored. (6) The interface between molten slag and crucible was set to be no slip wall.…”
Section: Methodsmentioning
confidence: 99%
“…However, 68% of Si feedstock is lost in various forms of Si-containing waste during the PV production chain, where more than 40% of high-purity Si is wasted by slicing of wafers using a wire sawing process . The recycling of the Si kerf loss is considered as a cost-effective and circular-economy solution for an advanced low-cost Si-based PV, which has received plenty of attention. , Although the kerf loss of Si particles remains in high purity, it is noteworthy that the boron (B) and phosphorus (P) content in Si particles increases significantly [about dozens to hundreds of parts per million (ppm)] because of the contamination of electroplating solution containing pyrophosphate on the diamond wire saw, which limits the use of recycled Si powder as Si feedstock. , Briefly, B and P are removed step by step through the form of oxidizing slag for removing B and vacuum evaporation for removing P, which is of low-efficiency and high-energy consumption …”
Section: Introductionmentioning
confidence: 99%
“…B and P are the most typical impurities, and their contents in Si are about dozens to hundreds of parts per million (ppm). Two kinds of impurities often come from the contamination of electroplating solution containing pyrophosphate on the diamond wire saw or B/P addition of P/N batteries, which limits the use of recycled Si powder as Si feedstock. One of the biggest difficulties in the preparation of SoG-Si is how to deeply remove traces of B and P. The small separation coefficient is an important reason for the difficulty in deep separation of the two impurities. For example, the partition coefficient of B and P in the slag refining process is usually less than 10, , and the segregation coefficient of B and P in the solidification segregation process is close to 1 .…”
Section: Introductionmentioning
confidence: 99%
“…In the aspect of the preparation of high-purity silicon, DWSSP has more advantages than does silicon ore . Therefore, disposal and recycling of DWSSP have become the focus of the global photovoltaic industry. , …”
Section: Introductionmentioning
confidence: 99%
“…In the aspect of the preparation of high-purity silicon, DWSSP has more advantages than does silicon ore. 8 Therefore, disposal and recycling of DWSSP have become the focus of the global photovoltaic industry. 14,15 Various research had been carried out to find ways to recover silicon from DWSSP. The proposed disposal methods included acid leaching method to remove metallic impurities in DWSSP, 16−19 the two-stage thermal plasma process to recycle silicon from DWSSP, 20 the vacuum carbothermal reduction and hydrobromination reaction method to eliminate silicon oxide, 21,22 contamination, 23 and the slag treatment process for silicon recycling.…”
Section: ■ Introductionmentioning
confidence: 99%