Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method

Song, Ning; Liu, Wei-Fei; Wang, Li-Juan; Liao, Juan; Huang, Jian; Zhao, Meng; Zhao, Man; Tang, Yun-Zhi; Tan, Yu-Hui; Fan, Xiao-Wei

doi:10.1016/j.matchar.2024.114187

Materials Characterization

2024

DOI: 10.1016/j.matchar.2024.114187

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Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method

Ning Song,

Wei-Fei Liu,

Li-Juan Wang

et al.

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Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Huang,

Liu,

Chen

et al. 2024

Journal of Alloys and Compounds

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Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Huang,

Liu,

Chen

et al. 2024

Journal of Alloys and Compounds

View full text Add to dashboard Cite

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Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method

Cited by 1 publication

References 31 publications

Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

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