2021
DOI: 10.1039/d0ra09729b
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Preparation of Ni micropillar arrays with high aspect ratios using anodic porous alumina template and their application to molds for imprinting

Abstract: Ni micropillar array with high aspect ratio prepared using anodic porous alumina.

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Cited by 4 publications
(4 citation statements)
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“…The alumina layer at the resist openings was completely dissolved, not only on the surface but also in the depth direction, exposing the Al substrate at the bottom of the micrometer-sized pores. This is because the etchant penetrated the bottom of the pore of anodic porous alumina during etching, resulting in uniform dissolution from the top to the bottom of the pore …”
Section: Resultsmentioning
confidence: 99%
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“…The alumina layer at the resist openings was completely dissolved, not only on the surface but also in the depth direction, exposing the Al substrate at the bottom of the micrometer-sized pores. This is because the etchant penetrated the bottom of the pore of anodic porous alumina during etching, resulting in uniform dissolution from the top to the bottom of the pore …”
Section: Resultsmentioning
confidence: 99%
“…As the thickness of the resulting anodic porous alumina corresponds to that of the framework layer, the thickness of the framework was controlled in the range of 30–100 μm by varying the anodization time. A resist mask was formed on the ordered anodic porous alumina using a poly­(dimethylsiloxane) (PDMS) stamp with a square array of micrometer-sized convex patterns (Figure (b)). , The PDMS stamp was prepared by molding an original pattern fabricated by electron beam lithography as a template. To form the resist film on the surface of the PDMS stamp, the stamp was immersed in a toluene solution containing 0.5 wt % polychloroprene at 30 °C, held for 10 s, and then pulled up at a constant speed of 0.5 mm s –1 using a desktop dip coater (DC4200, Aiden, Japan).…”
Section: Experimental Sectionmentioning
confidence: 99%
“…First, anodic porous alumina with hierarchical structures was prepared by an integrated process composed of anodization and selective patterning. 27,28 Next, polymer negatives of anodic porous alumina with the hierarchical structures were formed, and nally, the exible mold was obtained by molding using the polymer negative as a mold. This process can effectively form high-aspect-ratio micropillars with nanopillar arrays at their tips on curved surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…This process is based on the previously reported technique using a resist mask for selective etching with a flexible mold of poly (dimethylsiloxane) (PDMS). [16][17][18] If the resist mask formed on the surface of the Al substrate can control the starting point of hole development during anodization, ideally ordered anodic porous alumina can be obtained without the need to press a hard mold under high pressure. This also means that an ideally ordered nanohole array with a large area can be obtained without the deterioration of the molds.…”
mentioning
confidence: 99%