Preparation of polyimide-epoxy composites

Gaw, Kevin; Kikei, Mitsutoshi; Kakimoto, Masa–aki; Imai, Yoshio

doi:10.1016/1381-5148(95)00132-8

Cited by 34 publications

(22 citation statements)

References 3 publications

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“…However, some generalizations can be inferred from infrared spectra and differential scanning calorimetry studies. The systems tend to form ester linkages first followed by the imidization of the polyamic acid at higher temperatures liberating hydroxyl groups allowing the epoxy matrix to be crosslinked by ether linkages [73,101]. …”

Section: Reactions Between Epoxy-polyimide Resulting In Ipn Formationmentioning

confidence: 99%

“…These problems have been largely circumvented by employing a low boiling point solvent system developed by Echigo et al [82][83][84] containing tetrahydrofuran (THF) and methanol (MeOH) for the synthesis of polyamic acid. As seen by Gaw et al, THF/MeOH easily solvates both the polyamic acid and epoxy monomers forming stable solutions and is easily removed prior to cure [73]. The THF/MeOH solvent can be completely removed prior to any epoxy curing or imidization steps eliminating the problems associated with DMAc or NMP removal as seen in Fig.…”

Section: Development Of Volatile Solvent Systemsmentioning

confidence: 89%

“…A molecularly interlocked IPN of epoxy and polyimide was developed by Gaw et al to form molecular composites of ODA-PMDA polyimide and DGEBA epoxy [73]. In this system the epoxy monomers were homogeneously mixed with a fully polymerized precursor to the polyimide, polyamic acid, that contained reactive groups that could react with the epoxy forming the three dimensional network.…”

Section: Manufacture Methodologymentioning

confidence: 99%

“…2. Using THF/MeOH solvated polyamic acid as a precursor to the highly insoluble polyimide is, to date, the only methodology capable of making epoxy-polyimide composites having polyimide contents greater than 15% [73]. This system shows great promise in manufacturing epoxy-polyimide been fabricated using this solvent system include those derived from monomers listed in Fig.…”

Section: Development Of Volatile Solvent Systemsmentioning

confidence: 98%

“…All systems in the figures were cured to apparent completeness as determined by the lack of an exotherm in the DSC of the cured samples [73,101]. All variations in T g are the consequence of (I) the extent of molecular interaction resulting from varying the (DGEBA/ODA-PMDA PAA/PMDA) ratios, (II) changes in the network morphology (crosslink density), or (III) a combination of both of these effects.…”

Section: Phase Determination Via Dynamic Mechanical Testingmentioning

confidence: 99%

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Polyimide-Epoxy Composites

Gaw

Kakimoto

Progress in Polyimide Chemistry I

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Both polyimides and epoxy have found widespread use in many diverse industries. Polyimides, due to their excellent thermal and chemical stability and low dielectric constant, have become a favorite of the electronics industry. This broad class of polymers has found widespread use in a variety of electronic applications and the low cost has made epoxy popular as matrix materials in composites, adhesives and coatings.Both polyimide and epoxy possess a number of unusually valuable characteristics that make them amenable for use in a vast array of applications. Until quite recently, however, the two compounds have not been concurrently fabricated into a material that combines their desirable properties. Recently advances in polyimide solubility and have made the fabrication of polyimide-epoxy composites possible. This chapter reports the various fabrication strategies and problems encountered in synthesis and characterization of the formed composites and opens up the possibility of further endeavor in this field of research.

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Section: Reactions Between Epoxy-polyimide Resulting In Ipn Formationmentioning

confidence: 99%

Section: Development Of Volatile Solvent Systemsmentioning

confidence: 89%

Section: Manufacture Methodologymentioning

confidence: 99%

Section: Development Of Volatile Solvent Systemsmentioning

confidence: 98%

Section: Phase Determination Via Dynamic Mechanical Testingmentioning

confidence: 99%

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Polyimide-Epoxy Composites

Gaw

Kakimoto

Progress in Polyimide Chemistry I

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Die Attach Materials

Lu¹,

Sun

Wong

2013

Wiley Encyclopedia of Electrical and Electronics Engineering

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Die attach materials such as solder, polymeric adhesive pastes and films, and gold alloys are used to bond the chip (die) and the substrate. This article overviews the practical processing requirements of die attach materials and their application to semiconductor packaging, including die attach film for advanced BGA/CSP, Pb‐free packaging, and high‐power applications. In addition, dual‐function die attach films and future trends are also discussed.

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Curing and thermal behavior of epoxy resin in the presence of silicon‐containing amide amines

Khurana

Aggarwal

Narula

et al. 2002

J of Applied Polymer Sci

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ABSTRACT:The article describes the synthesis and characterization of silicon-containing amide amines obtained by the reaction of bis(4-chlorobenzoyl)dimethylsilane with 4,4Ј-diaminodiphenyl ether, 4,4Ј-diaminodiphenyl methane, 4,4Ј-diaminodiphenyl sulfone/3,3Ј-diaminodiphenyl sulfone, bis(3-aminophenyl)methyl phosphine oxide, and tris(3-aminophenyl)phosphine oxide with dimethyl acetamide as a solvent. Structural characterization of amide amines was done with Fourier transform infrared and 1 H-NMR spectroscopy. We used these aromatic amide amines as curing agents to investigate the effect of structure and molecular size on the curing and thermal behavior of diglycidyl ether of bisphenol A (DGEBA). The curing behavior of DGEBA in the presence of stoichiometric amounts of silicon-containing aromatic amide amines was investigated by differential canning calorimetry. A broad exothermic transition in the temperature range of 200 -300°C was observed in all the samples. The peak exotherm temperature was lowest in the case of phosphorus-containing amides and was highest in the case of ether-containing amides. Thermal stability of the isothermally cured resins was evaluated with dynamic thermogravimetry in a nitrogen atmosphere. A significant improvement in the char yield was observed with silicon-containing amines, and it was highest in case of samples with both silicon and phosphorus as flame-retarding elements.

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Preparation of polyimide-epoxy composites

Cited by 34 publications

References 3 publications

Polyimide-Epoxy Composites

Polyimide-Epoxy Composites

Die Attach Materials

Curing and thermal behavior of epoxy resin in the presence of silicon‐containing amide amines

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