Preparation of PZT-based piezoceramics with transgranular fracture mode

Piezoelectric Properties of Fine-Grained Pb(Mg1/3Nb2/3)O3–Pb(Zr,Ti)O3–Bi(Zn1/2Ti1/2)O3Quaternary Solid Solution Ceramics

“…In our previous studies, it was experimentally illustrated that both the base element of perovskite-structured oxides and the additive affect the cleanness of grain boundary, and transgranular fracture will happen when the bonding strength between grains is stronger than the grain bulk strength. 28) For the PMN-PZT-BZT systems studied here, the decreased sintering temperature of about 100 C implies that addition of NiO oxide plays a role of homogeneous liquid phase sintering additive and the transgranular fracture for the PMN37PT39 ceramics sintered above 1050 C supports the inference that they diffuse into ceramic lattice to form a clear grain boundaries. Ouchi et al ever studied the effect of various additives including MnO 2 , NiO, Fe 2 O 3 , and CoO on the piezoelectric properties of PMN-PZT and they also found that the NiO can promote grain growth and form a clearer grain boundaries.…”

Phase-formation, microstructure, and piezoelectric/dielectric properties of BiYO3-doped Pb(Zr0.53Ti0.47)O3 for piezoelectric energy harvesting devices

“…3 shows SEM images of the fracture surface for pure and modified PZT-BY ceramics. The pure PZT and PZT-BY(0.01) ceramics indicate a predominantly intergranular fracture [27], while the mixed mode of transgranular and intergranular fracture appears for highly BY-doped ceramics. On the other hand, the intergranular fracture mode of PZT-BY(x) containing x≥0.02 mol began to change to a mixed mode, as shown in Fig.…”

“…Therefore, the fracture mode transition observed in the PZT-BY(x) seems to be directly related to the content of the secondary phase. As the BY content increases, it can be intuited that the cohesive strength of the grain boundary can be strengthened, possibly due to either by introducing foreign atoms into the relatively weak boundary structure, or by the formation of semi-coherent bonding between the grain interface and precipitates [27].…”

Preparation and Characterization of Carbide Particle-Toughened Si–B System of High Thermostability Polycrystalline Diamond by HPHT Sintering

“…The typical feature of river stripes in Figure 9b-f indicates that the bonding strength at the diamond grain boundaries is enhanced above the fracture strength in the specific direction and plane of the diamond; thus, transcrystalline fracture occurs. The variation of fracture pattern from intercrystalline fracture to mixed fracture dominated by transcrystalline fracture is a typical feature of increased fracture toughness [34]. TmC particles also hinder further crack expansion by pinning the crack at the crack tip [35].…”