Present and Future of Pb-Free Solders.

Kawaguchi, Toranosuke

doi:10.5104/jiep1993.11.3_10

Cited by 5 publications

(1 citation statement)

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“…lead free solders and electrically conductive adhesives.) [1,2]. Among electricaly condutxive adhesives, isotropic conductive adhesives (ICA) are one of the more promising materials to replace lead-containing solders.…”

Section: Introductionmentioning

confidence: 99%

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Toida¹,

Shirai²,

Mizmura³

et al.

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Ag filled isotropic conductive adhesives (ICA) have been investigated as promising altenatives for lead containing solders in surface mount technology (SMT) applications; however, one serious concern is the ionic-mgration of the silver filled in the ICA, especially when used in high density interconnection assemblies. In his study, ionic-gration resistance and the contact resistnce of the ICA containing Ag-Sn alloy conducfive fillers were evaluated It was found that ionic-migrabon resistance depended on the Ag-Sn ratio and that Ag-Sn alloys containing 25 to 75 mol% of Sn had excellent ionic-migration resistance though their contact resistance was rather high, compared with silver. For the compatibility of the ionicn-migration resistance with lower contact resistance, and to undastand the effect of a Sn-Bi alloy powder mixture, several additives and polymer matrixes were also stxdied. New ICAs including these additives and a conventional ICA (as reference) werex evauated for SMT. Chip components with Sn plated termintions for stability in both contact resistance and adhesion strength were monitored during reliability tests. From the test results, it can be concluded that the new ICA is a potenfial material for SMT applications. Moreover, if mount loading was not sufficient and/or mount alignmient was not suitable, initial contact resistance was unstable. Therefore, we selected materials with reduction effect and we dereased the Sn ratio as low as we could The filler content rate was also increased. As a result the loading dependence was decreased.We were sucessful in keeping contact resistance more stable while maintning good ionic-migration resistance.

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Section: Introductionmentioning

confidence: 99%

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Toida¹,

Shirai²,

Mizmura³

et al.

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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show abstract

Conductive adhesive for plated Sn or Sn/Pb electrode

Komagata¹,

Toida²,

Hocchi³

et al.

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented At

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Nickel filled adhesives

Komagata

Yokoyama²,

Takai³

et al.

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium

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To make a conductive adhesive that can replace solder, we studied the following compositions: nickel as the conductive filler, an epoxy resin for the base resin and various phenolic resins as the curing agent. We found nickel-containing pastes that could cure at a relatively low temperature in short period having good adhesion strength.Moreover, we used these pastes for MLCC bonding in place of solder and found that, despite the fact that their volume resistivity was considerably higher than that of solder, their electrical properties were good.

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Present and Future of Pb-Free Solders.

Cited by 5 publications

References 0 publications

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Conductive adhesive for plated Sn or Sn/Pb electrode

Nickel filled adhesives

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