Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder

Liu, Yang; Ren, Boqiao; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Chen, Penghui; Zeng, Xianghua

doi:10.1007/s10854-021-06412-5

Cited by 4 publications

(1 citation statement)

References 23 publications

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“…The molten SB could fill into the micro pores of P-Cu by the surface-tension attraction of the P-Cu skeletons. However, as the high temperature lowered the surface tension, the efficiency of SB filling the pores was reduced (Liu et al , 2021). Therefore, the bonding strength weakened as the bonding temperature increased.…”

Section: Resultsmentioning

confidence: 99%

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Xiong,

He,

et al. 2023

SSMT

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Purpose This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB). Design/methodology/approach TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs). Findings The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal. Originality/value Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

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Section: Resultsmentioning

confidence: 99%

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Xiong,

He,

et al. 2023

SSMT

View full text Add to dashboard Cite

show abstract

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling

Chen

Liu

Zhang

et al. 2023

J Mater Sci: Mater Electron

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Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

Dele‐Afolabi

Ansari

Hanim

et al. 2023

Journal of Materials Research and Technology

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Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder

Abstract: In this study, porous metals (Ni, Cu) with the porosity of 110 and 500 ppi were, respectively, added into the SnBi solder joint to obtain the

Cited by 4 publications

References 23 publications

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

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