Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Myśliwiec, Marcin; Kisiel, Ryszard; Pavłov, Krystian; Kruszewski, Mirosław J.

doi:10.1109/isse54558.2022.9812830

Cited by 3 publications

(1 citation statement)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…According to previous reports [25,26], different sintering temperatures, pressures, heating times, and sizes and shapes of the Ag particles all affect the sintered Ag microstructure and sintering performance. The classical sintering process can be carried out at temperatures ranging from 200 to 300 • C with the sintering pressure range from 10 MPa to 40 MPa [27]. However, the pastes in which the powder particles are a few to several micrometers in size are processed at temperatures above 250 • C and at pressures higher than 10 MPa, which may increase the risk of chip damage and increase the process difficulty of chip fabrication.…”

Section: Introductionmentioning

confidence: 99%

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

Shen

2022

Nanomaterials

View full text Add to dashboard Cite

Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines as a coating agent for enhancing the pressureless sintering performance. This work systematically introduced the Ag nanoparticle modification process, Ag paste preparation, and sintering process and compared the changes in the sintering performance of Ag nanoparticles after modification with four different alkyl chain lengths of amines. The study showed that the sintered films of Ag nanoparticle pastes modified with n-octylamine (NOA) can achieve the lowest resistivity of the sintered film and the highest shear strength of the bonded joints. The resistivity of the sintered Ag film is affected by the grain size and microscopic morphology, and the strength of the bonded joints is also related to the sintering density and the amount of organic residues. The thermal behavior of the Ag particles coated with different amines is measured by thermal analysis. Finally, the mechanism of NOA-modified Ag nanoparticles to improve the sintering performance is proposed. This study can provide effective data and theoretical support for the further promotion and application of nano-Ag pressureless sintering.

show abstract

Section: Introductionmentioning

confidence: 99%

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

Shen

2022

Nanomaterials

View full text Add to dashboard Cite

show abstract

Pressureless sintering performance enhancement of Ag pastes by surface modification of Ag nanoparticles with tert-dodecyl mercaptan

Shen

et al. 2022

J Nanopart Res

View full text Add to dashboard Cite

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Myśliwiec

Kisiel

Kruszewski

2022

Self Cite

View full text Add to dashboard Cite

Purpose The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research. Design/methodology/approach Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints. Findings It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance. Originality/value The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

show abstract

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Cited by 3 publications

References 13 publications

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

Pressureless sintering performance enhancement of Ag pastes by surface modification of Ag nanoparticles with tert-dodecyl mercaptan

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Contact Info

Product

Resources

About