Abstract:Copper seed layer repair and pre-wetting are standard operation procedures (SOPs) for copper filling with void-free, through-silicon vias (TSVs). In this paper, a novel pretreatment with pre-wetting and cleaning is investigated based on the results of copper filling in via when copper oxide is present on the surface of the seed layer. The pre-wetting and cleaning are integrated into one step in the pretreatment. Basic Electrolyte Solution (BES) is chosen to be pre-wetting acidic liquid. A copper seed layer for… Show more
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