2016
DOI: 10.1021/acsnano.6b05042
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Prevention of Transition Metal Dichalcogenide Photodegradation by Encapsulation with h-BN Layers

Abstract: Transition metal dichalcogenides (TMDs) have recently received increasing attention because of their potential applications in semiconducting and optoelectronic devices exhibiting large optical absorptions in the visible range. However, some studies have reported that the grain boundaries of TMDs can be easily degraded by the presence of oxygen in water and by UV irradiation, ozone, and heating under ambient conditions. We herein demonstrate the photodegradation of WSe2 and MoSe2 by laser exposure (532 nm) and… Show more

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Cited by 94 publications
(90 citation statements)
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“…Based on our observations, we propose that e-beam-induced defects of optimal size provide sites for photo-oxidation to take place in WS 2 membranes in an ionic solution, which generally occur at grain boundaries, 14,15 leading to expansion of nanopores under laser illumination in KCl solution. Further studies are needed to explore the pore formation and expansion process in more detail and at the atomic scale using AC-HRSTEM characterization.…”
Section: Resultsmentioning
confidence: 80%
“…Based on our observations, we propose that e-beam-induced defects of optimal size provide sites for photo-oxidation to take place in WS 2 membranes in an ionic solution, which generally occur at grain boundaries, 14,15 leading to expansion of nanopores under laser illumination in KCl solution. Further studies are needed to explore the pore formation and expansion process in more detail and at the atomic scale using AC-HRSTEM characterization.…”
Section: Resultsmentioning
confidence: 80%
“…Similar issues are commonly found in, and have been addressed by, tooling systems for nanoimprint lithography (NIL). [44][45][46] With Mac-Imprint, the chemical resistance is an additional design consideration. Unlike NIL, this process only requires contact for etching to occur and a light pressure is used to make conformal contact.…”
Section: Future Workmentioning
confidence: 99%
“…Advancing the fabrication of microimprinted materials such as optical fi lms, microelectromechanical systems, biomicrochips, plastic, rubber, and composite materials for high-volume manufacturing is becoming more diffi cult due to the increased propensity of gas trapping and template damage. [1][2][3][4][5][6] Figure 1 compares the gaspermeable and conventional non-gas-permeable templates used in microimprint lithography. The increase in template damage and gas trapping caused by solvent and oxygen generated from cross-linked materials during UV or thermal curing processes is infl uenced by the pattern failure of the microimprinted materials.…”
Section: Introductionmentioning
confidence: 99%